China CEM 1/CEM 2/CEM 3 PCB Manufacturer

PCB Manufacture Capacity

Item

Specification

Material

FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc.

Remarks

High Tg CCL is Available(Tg>=170℃)

Finish Board Thickness

0.2 mm-6.00mm(8mil-126mil)

Surface Finish

Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)

Shape

Routing,Punch,V-cut,Chamfer

Surface Treatment

Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA)

Silkscreen(black, yellow, white)

Peel able-mask(red, blue, thickness>=300um)

Minimum Core

0.075mm(3mil)

Copper Thickness

1/2 oz min; 12oz max

Min Trace Width & Line Spacing

0.075mm/0.075mm(3mil/3mil)

Min Hole Diameter for CNC Drilling

0.1mm(4mil)

Min Hole Diameter for Punching

0.6mm(35mil)

Biggest panel size

610mm * 508mm

Hole Position

+/-0.075mm(3mil) CNC Drilling

Conductor Width(W)

+/-0.05mm(2mil) or +/-20% of original

Hole Diameter(H)

PTHL:+/-0.075mm(3mil)

Non PTHL:+/-0.05mm(2mil)

Outline Tolerance

+/-0.1mm(4mil) CNC Routing

Warp & Twist

0.70%

Insulation Resistance

10Kohm-20Mohm

Conductivity

<50ohm

Test Voltage

10-300V

Panel Size

110 x 100mm(min)

660 x 600mm(max)

Layer-layer misregistration

4 layers:0.15mm(6mil)max

6 layers:0.25mm(10mil)max

Min spacing between hole edge to circuitry pattern of an inner layer

0.25mm(10mil)

Min spacing between board outline to circuitry pattern of an inner layer

0.25mm(10mil)

Board thickness tolerance

4 layers:+/-0.13mm(5mil)