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Solar cell film laser scribing machine cutting machine
[ Technical Parameters ] | |
Model | OLS-20F |
Laser wavelength | 1064nm |
Laser power | 20W |
Scribing width | 30μm |
Scribing speed | 200-300mm/s |
Scribing accuracy | ±10μm |
Working area | 245x245mm |
Temperature control precision | 0.5°C |
Working power | 220V/50Hz/1kvA |
Working table | negative pressure absorbing and dust elimination |
Cooling method | Forced air cooling |


Scribing or cutting the Solar Cells and Silicon Wafers in the solar PV industry, including the mono-si (monocrystalline silicon) and poly-si (polycrystalline silicon)solar cells and the silicon wafer.

1. Using the Germany IPG FIBER laser or China Raycus Fiber laser or Max fiber laser
service time over 100,000hours.
Stronger adaptability to the environment
better beam quality and higher speed than Diode Pump and YAG Krypton type.
No need to replace the laser module and Krypton lamp.
2. Worktable: X-Y movable
A solar cell can be automatic absorption
3. Air cooling, compact structure, small size
4. Higher conversion efficiency,
lower operating cost, save power consumption, cost and shorter maintenance time;
5. Laser Pulse width is more narrow,
Higher peak power, faster scribing cutting speed
6. Long-time uninterrupted continuous maintenance-free operation,
no consumable wearing parts to replace
7. Stepper motor or servo motor at different costs.





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