Typical Uncured Properties:

Appearance

Red Gel

Viscosity (cps) Brookflied DVII+

SP14@5rpm@25 °C

250,000

Yield Value @25oC, Pa

560

Flash Point ( °C)

>100

Particle Size (microns)

(mean particle size, 15 microns)

Density (g/cm³ )

1.20

Copper Corrosion

No

Shelf Life (months @ 2 °C to 8  °C)

> 6

Cured Properties:

Density, BS5350    g/cm³

1.25

Coefficient of Thermal Expansion (ppm/ °C)

Alpha1

50

Alpha2

156

Modulus DMTA @ 1kHz (GPa)

2.5

Glass Transition Temperature, DSC (°C))

124

Thermal Conductivity (W/moK)

0.29

Specific Heat, kJ.kg-1.K-1

0.32

Overlap Shear Test (psi)

(Taiyo PSR 4000 coated FR4)

>2,200

Surface Insulation Resistance (Bellcore GR-78) 

After 4 Days (ohms) 

>109

After 7 Days (ohms)

>109

Dielectric Constant/Loss, ASTM D150

100KHz

3.9/0.015

Volume resistivity,ASTM D257,   cm

2.4x10¹⁵

Surface resistivity,ASTM D257

2.4x10¹⁵

Electromigration (Bellcore GR-78)

Passed

Electrolytic Corrosion,DIN 53489

AN-1.2

Hardness (Shore D)

> 84

Curing Condition:

3609F is designed to cure in 90 to 120 seconds at 
150°C and in 3 minutes at a temperature of 120°C. Rate of 
cure and final strength will depend on the residence time at 
the cure temperature. The following graph is recoMMended 
curing curve.

>109

>109

3609F is an epoxy surface mount adhesive that cures  rapidly at elevated temperatures  and  has been designed for use in high speed printed circuit board assembly for the attachment of surface mount components. The very

low moisture absorption allows expose to humidity in open  baths, without affecting  dispensability  or causing void formation in the cured adhesive. 3609F has been successfully used in dispense, particularly suited for high wet  strength and good electrical characteristics are required.

1. Excellent Dispensability at Speeds in Excess of 40k dph.

2. 3609F can be cured in 90 to 120 seconds at 150°C.

3. No Heavy Metals (Cd, Se).

Designed for use in high speed printed circuit board assembly for the attachment of surface mount components.