1.Laser wave length:1.064um 2.Scribe line width:less than 30um 3.Max scriber speed:140mm/s
This machine adopts the diode pump laser , it has the characters of higher integrative degree, better quality of laser beam, lower running cost and little maintenance during long time; The key components are adopt import products, simple structure for whole machine, fast scribing speed and higher precision, it can work continuously over 24hours.
Product Feature
Applicable field: Scribing for the mono-crystalline sillicon, poly-crystalline sllicon, amorphous -crystalline sillicon,solar cell,water in solar industry; cutting for the mono-crystalline sillicon and poly-crystalline sllicon in electronic industry.
Technical Parameter
Model
HT-SDS50A
Laser wavelength
1.064um
Laser max power
≥50W
Scriber line width
≤30um
Laser repetition frequency
200Hz~50kHz
Max scriber speed
140mm/s
Work platform
350*350mm
Power supply
380V(220V)/50Hz/5kVA
Scriber precision
≤±10um
Cooling way
Outside suspension type constant temperature circulation water cooling
Work table
The adsorption of double gas warehouse vacuum, the T model platform
is double position woks in turn.
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