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Magaoding series paste is a front electrode for mono and multi-crystalline silicon solar cell wafers. It easily penetrates the anti-reflective (SiNx:H or TiO2-x) layer during the firing process and provides low contact resistance. Ag Paste can be co-fired with commercially available backside Al and Ag-Al Pastes.
These Silver Metallization Pastes are customizable to your process, thus increasing efficiency and fill factor while providing wider processing windows.
Front Side Ag Paste Properties:
Capture higher efficiencies and wider processing window
Achieve a higher aspect ratio
Excellent fine line resolution
Low contact resistance on lightly doped emitter
Cd free
Pb free available
Applicable to a wide range of sheet emitter wafers
Back Side Ag Paste Properties:
Increased adhesion
Co-firable with back Aluminum and front Silver pastes
Greater peak adhesion strength
Increased paste coverage with superior results provides a high quality, cost effective solution
Customized Ag Paste Solutions.
Solids Content | 90~93% | |
Viscosity(Pa·S)(Brookfield HBT,25°C,10rpm) | 200-350 |
|
Fineness | <10μm | |
Screen(BOPP stainless steel) | 400/18mesh | |
Drying | 250~300°C/1min infrared stove,250~300°C/3min | |
Peak Temperature | 780~830°C | |
Dried Thickness | 22±3μm | |
Fired Thickness | 15±2μm | |
Adhesion(N) | >3N | |
(220°C,62Sn/36Pb/2Ag)solderability | >95% | |
(220°C,62Sn/36Pb/2Ag)weldability | 10Seconds | |
Photoelectricity Conversion Efficiency | Single crystal silicon, average conversion efficiency≥19.3 Polysilicon, average conversion efficiency ≥17.8 | |











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