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small size reflow oven for lab research and beginning led production
small size reflow oven for lab research and beginning led production
small size reflow oven for lab research and beginning led production
small size reflow oven for lab research and beginning led production
small size reflow oven for lab research and beginning led production

small size reflow oven for lab research and beginning led production

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Price:RUB 76.52 - RUB 229.54

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Product Overview

Description

Product Description

small size reflow oven , machine to manufacture led lamp , suitable for lab research and starters in LED industry


Nseccesary machines in LED / SMT / SMD Production Line


Product Usage :    soldering LED CHIPS , IC components , SMT / SMD components on the PCB boards

Product Name :           GSD-S5C  Reflow Soldering Machine/Reflow Oven


Machine
01
Dimension
3.0m (L) *0.7 m(W) *1.4 m (H)
02
Weight
320 KG
03
Power Supply
A3 phases , 380V , 50HZ
04
Normal Working Power
4.5 KW
05
Total Working Power
17.5 KW
06
Control System
PC + PLC
PCB Transmission System
01
PCB Size
350 mm (W)
02
PCB Transmission Method
Mesh Belt
04
Wide Range of Mesh Belt
400 mm
05
PCB Transmission Direction
L to R
06
PCB Transmission Direction
0 ~ 1200 mm / min
Heating and Cooling System
01
Heating / Cooling Zones
10 Heating Zones ( Up 5, Down 5)
2 Cooling Zones
02
Heating Method
Up ------- Hot Air Heating
Down ------ Infrared Heating
03
Cooling Method
Forced Air Cooling , 2 independent cooling areas
04
Heating Zone Length
1.74 m (1740 mm)
05
Heating Temperature Range
Room Temperature ~ 300 ℃
06
Heating Temperature Accuracy
± 1~2 ℃
07
Heating Temperature Variation
± 2 ℃
Key Parts and Components
01
Conveyor Motor
Panasonic
02
Power Failure Protection -----UPS
American UMA
03
Hot Air Motor
120 W Shanyue from Taiwan
04
Intermediate Relay
Omron
05
Thermal Fuse
Imported Nickel Chrome Wire
06
Solid State Relay
40 A from Taiwan Yangji
07
Main Switch / Air Switch
Mitsubishi
Certifications
Detailed Images
Heating Zones
1. Good at soldering CSP, BGA, 0201CHIP and so on
2. 10 heating zones & 2 cooling zones
      2.1. Soldering temperature of each heating zone is independent control and adjustable
      2.2. Up and bottom hot air heating ensures the uniform soldering temperature and solve the dead angle problem
3.  Less than 20 minutes pre-heating time
4.  Optimum design of muti-layer heat insulation
          4.1 reduce the heat loss
          4.2 decrease the fuel consumption
          4.3 save the cost and improve the heating efficiency

Control System

1.Computer Control & Emergency Manual Control

2.Windows Operation Interface with English and Chinese Language

3.PC + PLC Full Automatic Control, stable and accurate

Transporting system

1. Transmission Mode of PCB :
      1. VSVF (Stepless Variable-Speed Variable-Frequency)
      2. Synchronized Mesh belt and Chain Rails 
      3. Excellent Stability
2.  The Mesh Belt : 
      1. Special quality aluminum made
      2. Long service life

Temperature Monitoring System

1. Whole - process monitoring
     1.1 Monitor the PCB temperature during the whole soldering period
2. Real time monitoring
    2.1 The changing temperature in every second can be noticed , collected and generated a data curve
3. Intelligent monitoring
    3.1 PID temperature control system can automatically keep the temperature curve goes like the one you set
    3.2 The temperature curve of the soldering are stored in the computer for whenever you use it

Cleints and Company
Packing & Delivery
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