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Description
KY6250S general-purpose Polyimide Adhesive Tape is made of polyimide film coated with heat-resistant silicone adhesive designed for solder masking or other very high temperature applications, KY6250RL is KY6250S with release liner PET film or paper, used for die-cuts of all kinds of insulated parts.
Features
•Thermal Class H
•Good adhesion
•Excellent electrical insulation.
•Solvent resistance
•No resin residue
Applications
• Mask for protection of gold fingers of PCB during wave solder, solder reflow or solder dip process)
• Fixing of electrical coils in motors, transformers, capacitors and electronic components etc
• Release surface in fabrication of parts cured at elevated temperatures. .
• All kinds of insulation Die-cuts, Discs
Specification
Properties | Unit | KY6250SG | KY6250RL | ||
Nominal Thickness(PI + Silicone) | mm | 0.025+0.035 | 0.05+0.05 | 0.025+0.035 | 0.04+0.03 |
Thickness of the Release Liner | mm | -- | -- | 0.050 / 0.075 | 0.075 |
Breakdown strength | KV | ≥ 5 | ≥ 6 | ≥ 5.0 | ≥ 6.5 |
Tensile strength | Mpa | ≥ 135 | ≥ 200 | ≥ 115 | ≥ 115 |
Elongation | % | ≥ 50 | ≥ 35 | ≥ 50 | |
Peeling strength | N/25 mm | ≥5.2* | ≥5.2 | ≥5.2* | |
Working temperature | ℃ | 180 (long-term ) | |||
260℃(15 minutes, no remains of adhesive) | |||||
Short-term ultimate working temperature | ℃ | - 73 ~ + 268 | |||
Slitting and Packaging
1, Width: 6.0~1000mm; Nominal Length:33m (36yds)or 66m(72yds)
2, Core ID:38mm(1.5”), 76mm(3"), Plastic Core
3. Packaging: Carton and Plastic Pallet.
Note: Above values are the accumulative typical ones by recognized testing method, but, in order to ensure you to select our products properly, please refer to above specification and test the samples based on your using purpose or feel free to contact us for more details.
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