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Number of layer 1-16 layer
Finishing HASL Lead Free,OSP,Immersion gold, Immersionsilver, gold fingers
Material FR4, High Tg FR4, Rogers, Aluminim
Board Thickness 0.4-3.0mm (15.7mils-118mils)
Copper Thickness 1/2OZ-3OZ
Min Line Width 0.075mm (3mil)
Min drill size 0.2mm (8mil)
Min laser drill size 0.067mm (3mil)
Type of Assembly \tTHD,SMT,SMT&THD Mixed
Components smallest size 0201, BGA, QFN
SMT Capability 2,000,000 points per day
DIP Capability 400,000 points per day
Process Lead-free
Testing X-ray ,AOI
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AOI
PRINTING
X-RAY
A:1,Gerber file
2,Quantity
3,Technical requirement
4,BOM list
A: 1,PCB &FPC: within 1 hour
2,PCBA : within 2 days
A: T/T , Western Union,Paypal.
A:For samples,we'll finish the product and ship it within 7-10 working days. For bulk orders,usually 15-20 working days
New products from manufacturers at wholesale prices