Product Overview

Description

Micro Match IDC Flat Cable, IDC Flat Ribbon Cable Assembly

 

 Product Description                                                                                                                                         

 

Series No.	FMC-XXSNARXXX-01
Description	Micro Match IDC Flat Cable, IDC Flat Ribbon Cable Assembly
Pin ways	04P to 26P
Alternative Plating	G/F	Tin	Sel. Gold/Tin
	GO	SN	S0
Packing way	PE Bag /Tube/ Tray/ Plastic box/ Tape&Reel Packing.
MOQ	500PCS
Delivery time	1-2weeks after confirm order
Engineering Specifications	Rated Current:1.0AMP
	Contact Resistance: 20mΩ  Max
	Withstand Voltage:500V AC/DC
	Insulation Resistance:1000MΩ Min
	Operation Temperature: -40°c to +105°c
	Contact Material : Brass
	Contact Plating: Au Over Ni
	Insulator Material :Polyester (UL94V-0)
	Standard: PBT
	Max.Processing Temp: 180°c for 30-60 Seconds / (200°c for 10 Seconds)

 Drawings details                                                                                                                                                    

 

 

 

 FAQ                                                                                                                                                                                               

1.     What ‘s MOQ ?

        MOQ 500PCS.

2.     What’s samples quantity you can get with free?

        You can get 30pcs free samples

3.      What’s samples lead time?

         3-5 working day.

4.     What’s mass production delivery date?

         2 Weeks.

5.     What ‘s PCB Connector can provide?

Pin Header, Female Header, Box Header, Ejector header, IDC, DIP,Machine(Round) Pin, DIN 41612,MiNi Jumper,Wafer,

Micro Match, SIM Card, SATA, D_SUB,USB,IEEE1394,IC-Sockets, FFC/FPC, PLCC, SCSI, POGO PIN, IDC TO IDC Flat cable and Micro match Flat Cable.