CAPABILITY
|
STANDARD
|
ADVANCED
|
MinimumLayer Count
|
1
|
1
|
Maximum Layer Count
|
12
|
40
|
Material
|
FR-4 (Tg-135C, 145C, 170C), Halogen- free
Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003
Polyimide
Black FR-4
Arlon AR-350
CEM-3
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
PTFE
Metal Core Materials
Aluminum Core
|
Board Thickness
|
0.020"-0.125"
|
0.005"-0.250"
|
Maximum Board Size
|
16" x 22"
12" x 21"
22" x 28"
|
10" x 16"
16" x 22"
12" x 21"
22" x 28"
|
Copper Thickness
|
0.5 oz – 3 oz
|
0.25 oz – 12 oz
|
Minimum Trace Width / Spacing
|
0.004"/0.004"
|
0.003"/0.003"
|
Solder Mask Color
|
Green, Blue, Black, Red, Yellow, White, Clear, and customized
|
Silkscreen Color
|
White, Black, Yellow, Green, Red, Blue and customized
|
Minimum Hole Size
|
0.008"
|
0.004"
|
Finished Hole Size Tolerance
|
+/-0.003"
|
+/-0.002"
|
PCB Surface Finish
|
HASL (vertical & Horizontal), Lead Free HASL, OSP/Entek, ENIG, ENEPIG,
HASL + Gold Finger,Immersion Tin(ISn), Immersion Silver(IAg), Carbon
Ink, Hard Gold(Flash Gold), Soft Gold
|
IPC Class
|
Class 2
|
Class 3
|
Controlled Impedance Tolerance
|
+/-10 %
|
+/-5 %
|
Blind Vias
|
Yes
|
Yes
|
Buried Vias
|
Yes
|
Yes
|
Aspect Ratio
|
8/1
|
15/1
|
Minimum Core Thickness
|
0.004"
|
0.002"
|
Carbon Ink
|
Yes
|
Yes
|
Peelable Mask
|
Yes
|
Yes
|
Solder Sample
|
Yes
|
Yes
|
First Article
|
Yes
|
Yes
|
ISO 9001: 2008
|
Yes
|
Yes
|
ISO/TS16949: 2009
|
Yes
|
Yes
|
94v0
|
Yes
|
Yes
|