Шлам CMP для полировки сапфировых вафель

Product Overview

Description

CMP Slurry for Sapphire Wafer Polishing

Our advantages:
 1.A whole series of products
 2.Premium quality of products
 3.Strong R & D strength
 4.A high efficient professional team
 5.Reasonable price and excellent service
 6.On time delivery, zero failure

Silicon Oxide Slurry

Silicon oxide slurries are achieved with silicon dioxide particles fully dispersed in the liquid with the available sizes as follows:  

The available size is from 20nm to 140nm.

The technical data of SiO2 slurry is as below

Appearance:Milk white liquid

Content(SiO2%): 40%±2%

pH value: 10±0.5

Specific gravity(20℃): 1.25-1.30

Viscosity(20℃): less than 10 c.p

1. Appearance

 Milk white

2. Chemical composition

(1)  Good polishing effect: less impurity and contamination on the polishing surface, easily to clean, high surface finishing, low surface roughness, no scratch;

(2)  Easily to use: suitable for general polishing process, and can be directly used or use after diluted with deionized water;

(3)  High removal rate: adopt advanced CMP technology for super-hard materials, to improve the polishing efficiency and save processing time.

3. Application

Lapping and Polishing SiC, sapphire substrate wafer, etc.

4. Operating requirements

(1)  Directly use

(2)  Mixture ratio of  suspension and deionized water is 1:1-1:5.

5. Package: 20Kg/ barrel

6. Announcements

(1) Storage condition: Proper temperature 5°C-30°C, avoid solarization

(2) Storage time: half year