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SPECIFICATION
Application: Mainly used in the field of radiating coating, thermal conductivity glue, conductive plastics, conductive rubber, LED cooling etc.
Performance:
(1)Excellent performance of thermal conductivity, With PC composite prepared insulation materials thermal
conductivity more than 15W/mK,With PA6 composite prepared insulation materials thermal conductivity more
than 20W/mK.
(2)Pieces of thin, easy to disperse, easy processing.
(3)Having the lower percolation threshold.
Model | Standard value | ||||||||
tap density (g/ml) | particle-size analysis | purity (%) | water (%) | ash content (%) | Sheet thicknes (nm) | thermal conductivity (w/m.k) | |||
D10/(um) | D50/(um) | D90/(um) | |||||||
SE1330 | 0.05~0.08 | ≤15 | ≤30 | ≤60 | ≥99 | ≤0.5 | ≤0.5 | ≤5 | 5300 |
IMAGE
Bag Packing
Bottle Packing