PZT ceramics conductive silver paste

Product Overview

Description

In High temperature conductive silver ink technology for PCB ceramics substrate, glass is used for various ceramics substrate applications. Functional glass can be used as an abrasion-resistant protective layer for functional elements, as an insulating layer on a conductive structure, or as an adhesion undercoating on aluminum nitride (AlN) or metal substrates. Finely ground glass is used in thick film technology as an additive, for example in silver pastes as an adhesive and contact agent. The adhesion is accomplished either by mechanical bonding or by chemical bonding through crystallization of the glass. The crystallization tendency of the glass can be controlled, and therefore adjusted to the requirements of various applications. Further properties, for example the shrinkage behavior or the thermal expansion coefficient are adjusted by the glass composition to fit the requirements of the desired application. In addition, the chemical properties of the glass, like the chemical stability or pH-sensitivity can be varied within a wide range.

 

 These conductive silver inks are especially compounded to resist migration after poling. Systems are also available for
mechanical contact use or contacting by soldering. The normal pastes are designed to fire in the region of 600°C to 900°C.

Pastes are available to fire at lower temperatures to suit the newer ceramic materials also metallo-organic systems have been used to give thin layers on other Ferro-electric components.

Pastes have been formulated for low temperature composite systems these are used both as temporary and permanent electrodes.

 

Silver Content(%)	65-86%
Viscosity	70±25 Pa•s( 10 rpm, 25°C±0.5°C,1min)
Fineness	<10μm
Solid Content	82±2%
Screen Mesh	250~300 stainless steel screen
Leveling Time	at room temperature,2~3min
Drying	120~150°C /( >15 min)
Firing	700-850°C/>10min
Film Thickness	14±2 μm
Conductivity(mΩ/sq)	≤4
Solderability	Good
Weldability	≥4 times(235°C,10s,PbSn solder)
Adhesion(N/2×2mm2)	≥30