0.5 4.5V Gas Pressure Oxygen Sensor Sensor Transmitter Module 0 100KPa

Product Overview

Description

XGZP6847 Pressure Sensor Module 
Features:
 Ranges: -100kPa~0kPa…1000kPa(-15PSI~0PSI…150PSI) 
 Perfect Accuracy(±1.0%) of full scale 
 Gage,Vacuum Type 
For Non-corrosive gas or dry air 
 Calibrated,Amplified analog output 
 Temp. Compensated:0°C~+85°C(32°F~+185°F) 
Direct application,Low Cost.

Applications:
 For Medical equipment field, such as therapy equipment, breathing machine, oxygen 
generating equipment,monitor,alcohol tester.etc.  

 For Sport and fitness equipment field,such as massage,air spring bed,etc. 
For Home appliance field, such as washing machine,active oxygen water machine beer 
machine,coffee machine, etc. 
 For Other fields, such as air pump,emergency lamp, dust collector, HVAC and pneumatic 
device etc.

Introduction:
XGZP6847 is a prefect silicon pressure sensor module offering a ratiometric analog interface 
for reading pressure over the specified full scale pressure span and temp.range. 
The XGZP6847 incorporates a silicon piezoresistive pressure sensor(XGZP SOP6) and an 
on-board Application Specific Integrated Circuit(ASIC) under PC board in a DIP8 package. 
The XGZP6847 is fully calibrated and temperature compensated for offset,sensitivity, 
temperature and non-linearity,so XGZP6847 pressure sensor module satisfy the prefect 
repeatability,linearity, stability and sensibility, which can be applied directly in medical equipment, 
fitness machine,home electronics,and other pneumatic devices etc. 
XGZP6847 pressure sensor module is for high volume application at an affordable cost and 
perfect performance.

  Custom calibrations(excitation voltage,output voltage,and pressure range) are available. 

Performance Parameter 
Unless otherwise specified, measurements were taken with a supply voltage of 5 Vdc at a 
temperature of 25±1 and °C humidity ranging from 25~85 

Item Data Unit:

Output Signal	0.5-4.5V
Accuracy	±1.0  Span
TSO(Temp. Coefficient of Offset)	±0.03  FS/°C
TCS(Temp. Coefficient of Span)	±0.03  FS/°C
Long Term Stability(1year )	±2  Span 2X (≤500kPa)
Over Pressure	1.5X(≥500kPa) Rated
Compensation Temp	0 ~ 85/32 ~ 176 °C/°F
Ambient Temp	-20 ~ 100/-4 ~ 212 °C/°F
Storage Temp	-40 ~ 125/-40 ~ 257 °C/°F
Pressure Range	100kPa=0.1MPa=1bar≈14.5PSI

Pressure Range(kPa) Model: 
0 ~ 10                     XGZP6847010KPG 
0 ~ 20                     XGZP6847020KPG 
0 ~ 40                     XGZP6847040KPG 
0 ~ 100                  XGZP6847100KPG 
0 ~ 200                  XGZP6847200KPG 
0 ~ 500                  XGZP6847500KPG 
0 ~ 700                  XGZP6847700KPG 
0 ~ 1000                XGZP6847001MPG 
-100 ~ 0                XGZP6847100KPGN 
-30 ~ 0                  XGZP6847030KPGN 
-20 ~ 0                  XGZP6847020KPGN 
-40 ~ 40                XGZP6847040KPGPN 
-100 ~ 100           XGZP6847100KPGPN

-100 ~ 700           XGZP6847700KPGPN 
Available for more custom pressure range

Dimension (Unit:mm/Inch) 

1         2         3        4        5        6 
N/C  Vdd  GND  Vdd  OUT  GND 
NOTE: 
1,N/C Pins must be left floating 
2,Soldering of lead Pins:250’C for 5 sec max.

Notes: 
1.Attention that the medium should be compatible with the pressure parts. 
2.Please contact us if special request on parameter and application. 


XGZP6847 Output VS.Pressure

Model   100KPGN    030KPGN    020KPGN
Output (V)            Pressure(kPa) 
0.5             -100              -30                -20 
1.5             -75               -22.5              -15 
2.5             -50              -15                  -10 
3.5            -25               -7.5                   -5               
4.5              0                  0                       0

Notes: 
Mounting 
Adopting land on the PC board for ensuring the sensor is securely fixed. 

 Soldering 
Due to its small size, the thermal capacity of the pressure sensor is low.Therefore, take steps to 
minimize the effects of external heat. 
Damage and changes to characteristics may occur due to heat deformation. 
Use a non-corrosive resin type of flux.

Since the pressure sensor is exposed to the atmosphere, do not allow flux to enter inside. 
 Manual soldering 
Set the soldering tip from 260 to 300°C (30W), and solder for no more than 5 seconds. 
Please note that output may change if the pressure is applied on the terminals when the 
soldering. 
Thoroughly clean the soldering iron. 
 SMD soldering 
Please keep the SMD solder bath temperature no higher than 260°C/500°F. When soldering, 
heat should be applied no longer than five seconds. 
When mounting onto a PCB of low thermal capacity, please avoid SMD soldering as this may 
cause heat deformity. 
 Solder reworking 
Finish reworking in one operation. 
For reworking of the solder bridge, use a soldering iron with a flat tip. Please do not add more 
flux when reworking. 
Please use a soldering iron that is below the temperature given in the specifications in order to 
maintain the correct temperature at the tip of the soldering iron. 
Too much force on the terminals will cause deformation and loss in effectiveness of the solder.

Therefore, please avoid dropping and careless handling of the product. 
Please control warping of the PCB within 0.05 mm of the sensor width. 
When cut folding the PCB after mounting the sensor, take measures to prevent stress to the 
soldered parts. 
The sensor terminals are designed to be exposed, so contact of the terminals with metal shards 
and the like will cause output errors. Therefore, please be careful and prevent things such as 
metal shards and hands from contacting the terminals. 
To prevent degradation of the PCB insulation after soldering, please be careful not to get 
chemicals on the sensor when coating. 
Please consult us regarding the use of lead-free solder. 

 Cleaning 
 Since the pressure sensor chip is exposed to the atmosphere, do not allow cleaning fluid to 
enter inside. 
 Avoid ultrasonic cleaning since this may cause breaks or disconnections in the wiring.

 Environment 
Please avoid using or storing the pressure sensor chip in a place exposed to corrosive gases 
(such as the gases given off by organic solvents, sulfurous acid gas, hydrogen sulfides, etc.) 
which will adversely affect the performance of the pressure sensor chip. 
Since this pressure sensor chip does not have a water-proof construction, please do not use 
the sensor in a location where it may be sprayed with water, etc. 
Avoid using the pressure sensors chip in an environment where condensation may form. 
Furthermore, its output may fluctuate if any moisture adhering to it freezes. 
The pressure sensor chip is constructed in such a way that its output will fluctuate when it is

exposed to light. Especially when pressure is to be applied by means of a transparent tube, take 
steps to prevent the pressure sensor chip from being exposed to light. 
Avoid using the pressure sensor chip where it will be susceptible to ultrasonic or other 
high-frequency vibration. 

 Quality check under actual loading conditions 
To assure reliability, check the sensor under actual loading conditions. Avoid any situation that 
may adversely affect its performance.

Other handling precautions 
That using the wrong pressure range or mounting method may result in accidents. 
The only direct pressure medium you can use is dry air. The use of other media, in particular, 
corrosive gases (organic solvent based gases, sulfurous acid based gases, and hydrogen sulfide 
based gases, etc.) and media that contains moisture or foreign substances will cause 
malfunction and damage. Please do not use them. 
The pressure sensor chip is positioned inside the pressure inlet. Never poke wires or other 
foreign matter through the pressure inlet since they may damage the chip or block the inlet. Avoid 
use when the atmospheric pressure inlet is blocked. 
Use an operating pressure which is within the rated pressure range. Using a pressure beyond 
this range may cause damage. 
Since static charge can damage the pressure sensor chip, bear in mind the following handling 
precautions. 
When storing the pressure sensor chips, use a conductive material to short the pins or wrap the 
entire chip in aluminum foil. Plastic containers should not be used to store or transport the 
chips since they readily become charged. 
When using the pressure sensor chips, all the charged articles on the bench surface and the 
work personnel should be grounded so that any ambient static will be safely discharged. 
Based on the pressure involved, give due consideration to the securing of the pressure sensor 
DIP type and to the securing and selection of the inlet tube.