Evaporative cooling pad resin material red resin glue

Product Overview

Description

Evaporative cooling pad resin material red resin glue

   The phenolic resin adhesive is a red-brown liquid, which is formed by polymerization of phenol, formaldehyde and auxiliary materials at high temperature.

   It has good chemical stability and high viscosity and elasticity. At the same time, because of its good stability and mobility, it has good working performance and workability.

   Has excellent aging resistance, water resistance, acid resistance and wrinkle resistance, this adhesive in use, non-toxic, does not contain heavy metals, no pollution, harmless to skin.

 

Item	Index
Appearance	Red-brown liquid
Curing Temperature	150 ℃
Solid Content	53 %
Golden Propotion	1:3
Shelf Life	3 months