Electronic Circuit Board / Electronic Board / Electronic PCB supplier

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Product Overview

Description



Product Description


Electronic Circuit Board / Electronic Board / Electronic PCB supplier :


PCB product show:


N-Y-X1


 


M11-Y-Y-X1


SMD_Y1-X


 


PCB-parameters:


Printed Circuit Board Production:



















































































































































































NO.ItemPrototypeMass Production
1Layer Count1-30 Layers1-20 Layers
2Max Panel Size≤1000X1000mm≤700X700mm
3Base Material TypeFR4,High Tg FR4, Rogers,Halogen FreeFR4,High Tg FR4, Rogers,Halogen Free
4Max Board Thickness≤10 mm≤10 mm
5Min Board Thickness2L≥0.2mm,4L≥ 0.3mm
6L≥0.4mm,8L≥0.6mm
10L≥0.65mm,12L≥0.8mm
2L≥0.2mm,4L≥ 0.3mm
6L≥0.4mm,8L≥0.6mm
10L≥0.65mm,12L≥0.8mm
6Min Line Width≥ 0.05mm(2mil)≥ 0.064mm(2.5mil)
7Min Line Space≥ 0.064mm(2.5mil)≥0.075mm(3mil)
8Min Through hole0.15mm(6mil)0.15mm(6mil)
9Min Blind hole0.1mm(4mil)0.1mm(4mil)
10Min Buried Hole0.2mm(8mil)0.2mm(8mil)
11Min Plated Hole Thickness20µm(0.8mil)20µm(0.8mil)
12Surface coatingHASL,ENIG, OSP,ENIG+OSP,Plating Ni/Au/Ag HASL,ENIG, OSP,ENIG+OSP,Plating Ni/Au/Ag 
13Solder Mask colorGreen,Blue,Black,White,Yellow,RedGreen,Blue,Black,White,Yellow,Red
14Silkscreen colorWhite,Black,Yellow,Red,White,Black,Yellow,Red,
15Thick  Copper 6oz/210µm4oz/140µm
16MIN S/M Pitch0.1mm(4mil)0.1mm(4mil)
17PTH Dia Tolerance ±0.076mm(±3mil)±0.076mm(±3mil)
18NPTH Dia Tolerance ±0.05mm(±2mil)±0.05mm(±2mil)
19Hole Position Deviation±0.05mm(±2mil)±0.05mm(±2mil)
20Outline Tolerance±0.15mm (±6mil)±0.15mm (±6mil)
21Controlled Impedance+/-5%+/-10%
22WARP and TWIST≤0.75%≤0.75%
23Flammability  Class94V-094V-0
24Solderability test255+/-5℃255+/-5℃
25Thermal  stress288+5℃,10Sec288+5℃,10Sec
26Test Voltage50-330V50-330V
27Adhesion TestNO PEELING NO PEELING
28Other Inspection itemIPC-6012  / A-600H IPC-6012  / A-600H


Production Delivery Time:

Through-hole Board Delivery Time

HDI Board Delivery Time

flow diagram:


Multilayer PCB-Process


 


HDI-Process





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