PCB Board Manufacturer in Shenzhen China

Product Overview

Description

1.Our service

- Contract Manufacturing 

- Engineering Services 

- PCB Design & Assembly 

- Component Procurement & Material Management 

- Product Design 

- Fast Track Prototyping 

- Cable and Wire Assemblies

- Plastics and Molds 

- Function Testing Service

 

2.Detailed Specification of PCB Manufacturing

 

1       Layer        1-12 layer

2       Material  FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum

3       Board thickness       0.2mm-7mm

4       Max.finished board side  500mm*500mm

5       Min.drilled hole size         0.25mm

6       Min.line width 0.075mm(3mil)

7       Min.line spaceing    0.075mm(3mil)

8       Surface finish/treatment          HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating

9       Copper thickness     0.5-4.0oz

10     Solder mask color    green/black/white/red/blue/yellow

11     Inner packing   Vacuum packing,Plastic bag

12     Outer packing  Standard carton packing

13     Hole tolerance          PTH:±0.076,NTPH:±0.05

14     Certificate        UL,ISO9001,ISO14001,ROHS,CQC

15     Profiling Punching    Routing,V-CUT,Beveling

16     Assembly Service      Providing OEM service to all sorts of printed circuit board assembly

 

 

3.Technical Requirement for PCB Assembly    

 

1.Professional Surface-mounting and Through-hole soldering Technology

2.Various sizes like 1206,0805,0603 components SMT technology

3.ICT(In Circuit Test),FCT(Functional Circuit Test) technology

4.PCB Assembly With UL,CE,FCC,Rohs Approval

5.Nitrogen gas reflow soldering technology for SMT

6.High Standard SMT&Solder Assembly Line

7.High density interconnected board placement technology capacity

4.Quote&Production Requirement      

 

1.Gerber File or PCB File for Bare PCB Board Fabrication

2.Bom(Bill of Material) for Assembly,PNP(Pick and Place file) and Components Position also needed in assembly

3.To reduce the quote time, please provide us the full part number for each components,Quantity per board also the quantity for orders.

4.Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate

 

5.OEM/ODM/EMS Services      

 

1.PCBA, PCB assembly: SMT & PTH & BGA

2.PCBA and enclosure design

3.Components sourcing and purchasing

4.Quick prototyping

5.Plastic injection molding

6.Metal sheet stamping

7.Final assembly

8.Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)

9.Custom clearance for material importing and product exporting

Other  PCB Assembly

 

6.Equipments     

 

1.SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4

2.Reflow Oven: FolunGwin FL-RX860

3.Wave Soldering Machine: FolunGwin ADS300

4.Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service

5.Fully Automatic SMT Stencil Printer: FolunGwin Win-5