Microwave PPO copper clad substrate with Low dielectric loss and light weight(TPH265)
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- Supplier: Taizhou Wangling Insulation Material Factory
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Product Overview
Description
A special microwave composite dielectric copper clad substrate(TPH-2)
1.Advantage for TPH-2 :
(1)The substrate is black. The dielectric constant is 2.65 and stable.
(2)The adhesive power between the copper and the substrate is more reliable than the vacuum film coating of ceramic substrate.This substrate is convenient for circuit processing,high percent of pass,and the manufacturing cost is much lower than the ceramic substrate.
(3)Dissipation factor tgδ≤1×10-3,and the loss has a slight variation with the rise of the frequency.
(4) Due to the specific gravity less,the remarkable characteristics of the module are weight lighter manufacturing by this substrate,which but other materials can't compared.
Product code des
2.Specifications:
Types | Double side |
Dimensions A×B(mm) | 6.3''x6.3''(160×160mm), 7.9''x7.9''(200×200mm) |
Tolerance(mm) | ±2 |
Thickness(including 1OZ copper) and Tolerance(mm) | 2.5±0.075 |
For special dimensions,customized lamination is available. | |
ED copper thickness(OZ) | 1OZ (electrodeposited copper foil) |
| Dielectric Constant(DK) |
2.65±0.05 |
Operating Temperature(℃) | Condition: High-low temperature chamber -100~+150(Processing temperature should not exceed 200℃) |
Dissipation factor (@ 10GHz) | Less than or equal to 0.001 |
Copper peel strength (1oz copper) | Condition: normal state ≥6N/cm |
Surface Resistivity (MΩ.cm ) | ≥1×106 |
Volume Resistivity (MΩ.cm ) | ≥1×109 |
Thermal conductivity (W/m/k) | 0.3 |
Moisture Absorption (%) |
Condition: Dip in distilled water of 20±2℃ for 24 hours ≤0.02
|
Coefficient of thermal expansion(ppm/℃) X Axis Y Axis Z Axis | Condition: -55℃ to 288℃ <50 <50 <50 |
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