Absolute or gage pressure sensor chip for medical device application
- Category: >>>
- Supplier: WuHu CFSensor Co. Ltd.
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Product Overview
Description
Product Description
Feature
Ranges: 0~7kPa…200kPa(0~1PSI…30PSI)
Piezoresistive MEMS Technology
Solid state,High reliability
Absolute,Gauge,Excited by voltage or current.
Cost effective
Application
• For Medical and healthy equipment field, such as Blood pressure test and monitor, Patient Monitoring, Infusion and Syringe Pumps, Anesthesia Machines, Respirators and Ventilators, NPWT, DVT, COPD Treatment, catheter, Kidney dialysis, Cupping& Cosmetology, Massage device etc.
• For Home appliance field, such as Refrigerator, Printer, Humidifier, Washer/Dryer, Coffee Machine, Cleaner, Robotic, Emergency Lamp,Sport Equipment etc.
• For Other fields, such as air pump, emergency lamp, dust collector, HVAC and pneumatic device,automotive application etc.
Introduction
XGZP2004 series pressure sensor chips are designed and fabricated by MEMS technology on six inch silicon wafers in a class 100 clean room. The pressure sensing chip is composed of a springy diaphragm and four resistors integrated in the diaphragm. Four piezo-resistors form a Wheatstone bridge structure. When the springy diaphragm is pressured, Wheatstone bridge produces a linear millivolt voltage that is proportional to input pressure.
Chip size is 2.0×2.0×0.4 mm(0.08×0.08×0.015 in) for silicon bonding without glass, or 2.0×2.0×0.9 mm(0.08×0.08×0.035 in) with glass.(Unless otherwise specified, the chip with pressure ≤200kPa come without glass)
With good repeatability, linearity, stability and sensibility, XGZP2004 is also easy for users to calibrate output, thermal drift and make temperature compensation by using operational amplifier or integrated circuit.
Electronic Performance
1.Power supply/Excitation: ≤10VDC or ≤3.0mADC
2. Input impedance : 4KΩ~6KΩ
3. Output impedance : 4KΩ~6KΩ
Basic Conditions:
1.Medium: Air(Clean,dry air and Non-corrosive gases)
2.Medium temp: (25±1)℃/(77±1.8)℉
3.Environment temp.: (25±1)℃/(77±1.8)℉
4.Shock: 0.1g (1m/s2) Max
5.Humidity: (50%±10%) RH
6.Power supply: (5±0.005) VDC
Dimension (Unit:mm/Inch)
Electric connection
Bondpad | 1 | 2 | 3 | 4 | 5 |
Definition B1 | -Out | +In | -In | +Out | +Out |
Definition B2 | -Out | +In | -In | -In | +Out |
| Both B1 and B2 are available for application | |||||
Order Guide
Notes
1.ESD protection required
2.Attention that the medium should be compatible with the pressure parts.
3.Please contact us if special request on parameter and application.
Warranty
CFSensor warrants its products against defects in material and workmanship for 12 months from the date of shipment. Products not subjected to misuse will be repaired or reploced. CFSensor reserves the right to make changes without further notice to any products herein. CFSensor makes no warranty, representation or guarantee regarding the suitability of its products for any particular application. CFSensor does not assume any liability arising out of the application or use of any product or circuit and specifically disclaims, and all liability, without limitation consequential or incidental damages. The foregoing warranties are exclusive and in lieu of all other warranties, whether written, oral, implied or statutory. No implied statutory warranty or merchant ability or fitness for particular purpose shall apply.
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