SMT High end IGBT 8 Heating Zones PCB Vacuum Reflow Oven

Product Overview

Description

 

1.Significantly reduce solder welding bubbles so reduce the voiding rateas low as 1-2%.
2.Improve product performance and electrical welding binding site,andeffectively improve the reliability of welding quality solder joints.
3.Double-sided PCB can be used for weldinq,suitable for massproduction,continuous production line.Tact average control 20-60S.
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4.Vacuum,vacuumretention time,deflation time,so vacuum rate can beset freely.
5.Complete the welding of the PCB board of installation the Aluminumheat sinks.
6.The concept of environmental protection ultra-low powerconsumption.hiah insulation desian.Housing temperature does notexceed 40 degrees.
7.High efficiency,large capacity of flux recovery unit.
8.Using the integrated oxygen sensor technology,to ensure theprecision control of oxygen content and real-time/continuousmonitoring of the residual oxygen content in the furnace.

SMT High-end IGBT 8 Heating Zones  PCB Vacuum Reflow Oven-high efficiency,low void ratio