Microwave composite dielectric copper clad substrate with ceramic (TP300)high frequency microwave PPO materials

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Product Overview

Description


High quality microwave PPO copper clad substrate with ceramic (TP300)

 

1.Advantages:

(1)The dielectric constant is stable and can be optional within the range of 3~25 according to the design of circuit requirement;

(2) The adhesive power between the copper and the substrate is more reliable than the vacuum film coating of ceramic substrate;

(3)he loss has a slight variation with the rise of the frequency.

 

 

Product code des

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 2.Specifications:

Types

Double side,   Single side,  Original side

Dimensions A×B(mm) and Tolerance(mm)

 

6''x6''(150×150mm),  6.3''x6.3''(160×160mm),

7''x7''(180×180mm), 8''x8''(200×200mm),

6.7''x9.4''(170×240mm)

-2

Thickness(including copper) and Tolerance(mm)

0.8±0.05,  1.0±0.05,  1.2±0.05,  1.5±0.06,  2.0±0.075,

3.0±0.10,  4.0±0.10,  5.0±0.12,  6.0±0.12,  10.0±0.2

For special dimensions,customized lamination is available.

Copper thickness(OZ)

1/2 or 1  (electrodeposited copper foil )  
DK(εr)3.0
DK can be customized.

Dissipation factor

(@ 10GHz)

Less than or equal to 0.001

 Copper peel strength

(1oz copper)

 ≥6N/cm

Surface Resistivity

(MΩ.cm )

 ≥1×107

Volume Resistivity

(MΩ.cm )

 ≥1×109
 

Coefficient of thermal expansion(ppm/℃)

X  Axis

Y  Axis

Z  Axis

 

Condition: -55℃ to 288℃

<40

<40

<60

Workshop

initpintu__.jpg 3.jpg 3.Technical index:

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Applications

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0.2168 s.