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F23BUUM25-B1 is a small size and low profile of WiFi + BT Combo module with LGA (Land-Grid Array) footprint, board size is 40.0mm*33.0mm with module thickness of 5.4mm. It can be easily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides USB interface for WiFi to connect with host processor and high speed USB interface for BT.It also has a PCM interface for audio data transmission with direct link to external audio codec via BT controller. The WiFi throughput can go up to 300Mbps in theory by using 2x2 802.11n b/g/n MIMO technology and Bluetooth can support BT2.1and BT4.0.
F23BUUM25-B1 uses Realtek RTL8723BU, a highly integrated WiFi/BT single chip based on advanced COMS process. RTL8723BU integrates whole WiFi/BT function blocks into a chip, such as USB, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive components remained on PCB.




& Consumer Application
Tablet/Smart TV/IPTV/OTT/IPC/AI Speaker/Security System /Toys
& Commercial And OA Application
Printer/POS Terminal/Projector/Meeting System/Interactive WhiteBoard/Education Equipment
& Industrial And Vehical Application
Instruments/Vehicle before-assembly/ afterassembly/High-speed train/Charging pile
& Medical Application
Medical equipments/Medical instruments
& Other Consumer Electronic Products

Model No | F23BUUM25-B1 | Main Chipset | RTL8723BU |
WIFI/BT Interface | USB | WIFI Standars | IEEE 802.11b/g/n+BT4.0 |
Date Rates | 150Mbps | Certification | RoHS,REACH |
RF Antenna | external Antenn | OS Supported | Android /Linux/Windows |
Operating Frequency | 2.4-5.8GHz | Operating Voltagc | 5V |
Dimensions | 40.0x 33.0x5.4 mm | RF Chains | 1T1R |
Operating temperature | -0°C to 70°C | Storage temperature | -40°C to 8O°C |
Reference Design

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Detailed specifications docs,please download from the official website or sales.
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