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Ptfe woven glass fabric with ceramic filler copper-clad laminates(F4BTM350)
1.Description:
F4BTM-1/2 is laminated by laying up of the varnished glass cloth with Ptfe resin and filler with the Nano-ceramic,according to the scientific formulation and strict technology process. This product is better than F4BM in the electrical performance. Meanwhile,the heat dissipation effect is improved and coefficient of thermal expansion is smaller.
2.Specifications:
Types | Double side, Single side, Original side |
Dimensions (mm) | 460X610mm(18''X24''), 500X600mm(19.7''X23.7''), 914X1220mm(36''X48''), 1000X1220mm(39.4''X48''), 1000X1500mm(39.4''X59'') |
Special dimension can be customized according to customer’s requirement. | |
Dielectric Constant (@10GHZ) | 3.50±2% |
Dielectric layer thickness and Tolerance(mm) | 0.254±0.025, 0.508±0.05, 0.762±0.05, 0.787±0.05, 1.016±0.05, 1.27±0.05, 1.524±0.05, 2.0±0.075, 3.0±0.09, 4.0±0.1, 5.0±0.1, 6.0±0.12, 9.0±0.18, 10.0±0.18, 12.0±0.2 |
| For special dimensions,customized lamination is available. | |
Copper thickness (OZ) | 1/2 or 1 or 2 (electrodeposited copper foil) |
Dissipation factor (tgδ) | Test condition: 10GHz DK: 2.55~3.0 ≤1.5×10-3 |
| Test condition: 10GHz DK: 3.0~3.5 ≤2.0×10-3 | |
| Test condition: 10GHz DK: 4.0~10.2 ≤2.5×10-3 | |
Copper peel strength (1oz copper) | Condition:Normal state ≥18N/cm |
| Coefficient of thermal expansion(ppm/℃) (typical) X Axis Y Axis Z Axis | Test ondition: -55℃ to 288℃ DK: 2.55-3.0 X <15 Y <15 Z <65 |
| Test ondition: -55℃ to 288℃ DK: 3.2-3.5 X <15 Y <15 Z <55 | |
| Test ondition: -55℃ to 288℃ DK: 4.0-10.2 X <12 Y <14 Z <50 |

3.Technical index:
3.1 Mechanical strength & Chemical property

3.2 Electrical property

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