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High quality microwave PPO copper clad substrate with ceramic (TP-1/2)
1.Advantages:
(1)The dielectric constant is stable and can be optional within the range of 3~25 according to the design of circuit requirement;
(2) The operating temperature is -100℃~+150℃;
(3) The adhesive power between the copper and the substrate is more reliable than the vacuum film coating of ceramic substrate;
(4)Dissipation factor tgδ≤1×10-3,and the loss has a slight variation with the rise of the frequency.
2.Specifications:
Types | Double side, Single side, Original side |
Dimensions A×B(mm) and Tolerance(mm)
| 6''x6''(150×150mm), 6.3''x6.3''(160×160mm), 7.1''x7.1''(180×180mm), 7.9''x7.9''( 200×200mm), 6.6''x9.4''(170×240mm) |
-2 | |
Thickness(including 1oz copper) and Tolerance(mm) | 0.8±0.05, 1.0±0.05, 1.5±0.05, 2.0±0.075, 3.0±0.10, 4.0±0.10, 5.0±0.12, 6.0±0.12, 10.0±0.2 |
For special dimensions,customized lamination is available. | |
Copper thickness(OZ) | 1/2 or 1 (electrodeposited copper foil) |
| DK(εr) | 10.50 |
| DK can be customized. | |
Dissipation factor @ 10GHz | Less than or equal to 0.001 |
| Copper peel strength(1oz copper) | In normal state:more than 6N/cm |
| Surface Resistivity(MΩ.cm ) | ≥1×107 |
| Volume Resistivity(MΩ.cm ) | ≥1×109 |
| Thermal conductivity(W/m/k) | >0.6 |
Coefficient of thermal expansion(ppm/℃) X Axis Y Axis Z Axis |
Condition: -55℃ to 288℃ <40 <40 <60 |

3.Technical index:

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