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This machine is for repairing motherboard IC/Chip/Chipset of Laptop, Mobile, PC, iPhone, Xbox, etc. With features 3-heater(2xHot air+IR Preheating), embedded Smart PC, Auto Profile, Cooling Fan, Micro hot-air adjustment, Vacuum Pick-up & Place, Universal Support for most of the PCB Size/Shape.


1.Precise temperature control.
2.Target chip can be soldered or desoldered while no other components on PCB are damaged
3.No false welding or fake welding.
4.Three independent heating areas increase temperature gradually.
5.No damage to chip and PCB.
Humanized design makes the machine easy to operate. Normally a worker can learn to use it in 10 minutes. No special professional experiences or skills is needed, which is time- and energy-saving for your company..
1.CE certification guaranteed.
2.Voice warning around 5 seconds before soldering/desoldering process complete.
3.Automatic power-off protection device when abnormal accident happens, with a double over-heating protection control.
4.Emergency stop botton
SPECIFICATIONS | ||||||
Total Power | 4800W | |||||
Top heater Power | 800W (1st Hot air heater) | |||||
Bottom Heater | 1200W(2nd hot air heater), 2700W (IR preheat) | |||||
Temperature Accuracy | ±2℃ | |||||
Power Supply | AC 220V 50/60Hz (AC 110V optional) | |||||
Dimension | 800x900x750mm (L*W*H) | |||||
Temperature Profile Storage | 50,000 groups | |||||
Operation Mode | Manual+Touchscreen | |||||
PCB Support | V-groove + universal fixture + 5-points support + Adjustable in X direction | |||||
Temperature Control | K-type Thermocouple + Closed Loop + Auto compensation | |||||
PCB Size | Max.450x400mm, Min. 22x22mm | |||||
BGA Chip | 2x2mm-80x80mm | |||||
Minimum Chip Spacing | 0.15mm | |||||
External connector for temperature testing | 1pcs or Customized | |||||
Net Weight | 48KG | |||||


1) All the Nozzles are made by Titanium Alloy.
2) Top Nozzle has Reflow Vent to prevent the damage to surrounding components.
3) Magnetic Nozzle, Easy to install / adjust / change.
Manual smt pick and place machine bga ic reballing stencil VS wds-4860 bga repair machine

1) Cross air flow to cool the PCB after heating, it is important for prevent deformation
2) Auto Cooling after the heating complete.
Manual smt pick and place machine bga ic reballing stencil VS wds-4860 bga repair machine

A high Power LED light with flexible tube will give you a bright rework, you can effectively see the melting of tin or mold on small components.
Manual smt pick and place machine bga ic reballing stencil VS wds-4860 bga repair machine


With top air speed adjustable function, prevent small bga chip from moving flow by strong air.
Manual smt pick and place machine bga ic reballing stencil VS wds-4860 bga repair machine







This machine can be shipped to different countries.
For accurate shipping fee, please feel free to contact us.
* Your inquiries related to our products will be replied within 24 hours.
CPU IC removal replace tool Graphic cards repair BGA soldering machine
* OEM&ODM are welcome, OEM brand is available.
DH-5860 BGA rework station VS Zhuomao Seamark ZM BGA rework station
* Protection of your sales area, ideas of your design and all your private information.
DH-5860 BGA rework station VS Zhuomao Seamark ZM BGA rework station
* View our Factory.
* Training how to instal the machine, training how to use the machine.
* Engineers available to service machinery overseas.




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