Two component electronic sealant epoxy resin

Product Overview

Description

Product introduction:

This product is A room-temperature curing adhesive for electronic components, which is packaged in two components: A and B. Group A is divided into black (or white) viscous liquid, and group B is divided into brown-yellow liquid.The two components A and B can be mixed and fully stirred for sealing. The two components A and B can be stored separately for A long time (the storage period shall not be less than one year).This product has the characteristics of fast curing speed, easy defoaming, low shrinkage, non-toxic and harmless.The product has good electrical properties, and has a good curing surface, suitable for filling and sealing electronic devices and adhesive.

 

Range of application:

 

Filling and sealing electronic components, fast curing and plugging.

 

 

Product performance:

1: viscosity (25 ℃), CP: A: 5000 + 500 B: 100-20

2: density g/cm3: A: 1.55;B: 1.12

3: curing conditions: 25 ℃ / 8 hours (adjustable)

4: mixing ratio (weight ratio) : A:B=100:25

5: operating period of mixed glue: 60 minutes

6: The shelf life of : 25 ℃ / 12 months

 

 

Main features: advantages

1. Moderate curing speed

2: bright surface

3: good insulation performance

4. Two-component room temperature curing

5: high hardness, good toughness, good confidentiality

Advantages:

1: high production efficiency, no explosive polymerization

2: excellent appearance

3: improve the life of electrical appliances

4: reduce production costs

5: good toughness and confidentiality

 Method of use:

Mix the two components A and B in proportion of weight ratio A:B=100:25 and stir well. Then the surface can be solidified about 4 hours after filling and sealing.Note: components A and B should be mixed evenly before use, otherwise the properties of solidified materials will be affected;The adhesive shall be used up within the applicable period.

 

Safety matters:

1. Very few production personnel may have allergic reactions to epoxy resin, and appropriate protective measures should be taken, such as wearing protective glasses;

2. Components A and B must be accurately proportioned and evenly mixed;

3. The curing reaction of epoxy resin is exothermic, and the higher the temperature, the faster the curing reaction.If the amount of glue is too large at a time, the heat of curing reaction cannot be dispersed, causing a sharp rise in the system temperature, resulting in detonation (positive feedback reaction), and a large number of burning and air holes will be generated in curing materials.If the amount of glue is too large (more than 0.5kg) at one time, in order to prevent detonation, after the glue is mixed and mixed evenly, the glue should be quickly divided into several small containers or installed in a metal plate with better heat dissipation.

4. Acetone can be used to clean the uncured glue solution;

5. The packing of component A is easy to precipitate. Please mix component A well before use.

Packaging, transportation and storage:

Components A and B of this product are packed in plastic drums, A: 12Kg/ drum, B: 3Kg/ drum.This product is non-flammable and explosive, and can be transported according to general chemicals.

This product shall be sealed and stored in a cool and dry place. Component B shall be sealed and stored in a dark place for one year.