Product Overview
Description
Parameters:
1,Copper:Oxgen free copper; Copper content≥99.97%
2,Copper base resistivity:Oxgen free copper≤0.01724Ωmm2/m
3,Coating Comosition :60%Sn 40%Pb
4,Solder melting point:179-224℃
5,Coating tickness:0.01~0.04mm (Can be customized according to customer requirements),Double coating ;Uniform
6,Solder Tape elongation:Soft state ≥25%,Semi soft state≥15%
7,Width error:±0.05mm Thickness error:±0.005mm
Packing:
20M x Tab wire 1.8x0.16mm