ACF bonding head also name:ACF/TAB/COF/COG/FOG/FPC/FOF Bonding machine press head /bonding tip/welding heads/ Hot Bar / soldering heads / heater tip / heater tools/ thermode for hot bar / ACF Bonding machine cutter head/bonding cutter/heat cutter……
It have pulse heating and constant temperature bonding head.
Materials:
Normal materials:
-SUS440C steel
-Tungsten steel
-Titanium alloy (normal used in pulse heating bonding machine)
-Ceramic
-Brass
-and others.
Size:
It will be different sizes for different products, such as TV Panel/cell phone/Touch panel/camera/watch/ Heat Seal Paper/, every products have the different shapes and sizes, so we need to make the customized bonding head according to your products.
Applications:
ACF Bonding head has for many years, been used in glass display applications. Recently, it is also becoming widely used in TAB,COG,FOG,FOB,FOF,COF,COB areas.
– TAB Bonding (TCP-PCB / TCP-LCD)
– COG Bonding (IC-LCD)
– COB Bonding (IC-PCB)
– COF Bonding (COF-LCD/PCB)
– FOG Bonding(FPC-LCD)
– FOB Bonding(FPC-PCB)
– FOF Bonding(FPC-FPC)
– Plasma Display (FPC-PDP)
– Flip Chip Package
– ……
Features:
-Heat cure
-Fast bonding time
-High adhesion to plastic PET,COF & FPC, substrate
What is the pressure 1, The popular explanation: Using the head pressure, pressure head, temperature, time, optical alignment system will FPC, COF package with LCD and PCB after connection of ACF glue dependend curing conductive.
2, Professional explanation:
This pressure is the IC will have positioning, through high temperature and pressure head to make IC real fixed on the binding area.
Packaging & Shipping
Our Services
Company Information
Shenzhen Olian Automatic Equipment Co., Ltd (Olian) is a high-tech enterprise established in 2008, specialized in R&D, manufacturing and sales of LCD module automatic equipment.
Olian insist on the product concept of " High quality, High efficiency", have successfully developed standard and custom products:
Main products
1. LCD module machine:
Large, medium and small size COG machine, Semi-automatic COG machine, Automatic COG machine, ACF attach machine, COG press bonding machine, TAB, FOG hot press bonding machine, SMT machine, Tear film machine, detection device, PLASMA, LCD clearing machine;
Auxiliary equipment: IC disassembling machine, ACF split machine, Molybdenum wire machine, Heating platform, Manual or pneumatic test stand, etc;
2. Capacitive screen Touch screen device:
G + F laminating machine, G + G vacuum laminating machine, Touch screen ACF attach machine, Touch screen FOG, Hot press machine, PETOCA laminating machine, F + F, Automatic laminating machine, TP protective film laminating machine;
5. Accessories and maintenance of the LCD module and TP equipment: Quartz, Test stand, All kinds of bonding head( SU440C bonding head, Tungsten steel bonding head, Titanium alloy bonding head) production and maintenance, grinding or design.
Olian welcome customers to visit our company for technical exchange and business negotiation. Olian will do the best to provide you with high quality equipment and satisfactory service. Olian determined to become the leading brands of the industry.
Olian Welcome agents and reseller around the world,
