2.0mm 4 layer FR4 tg 150 ENIG printed circuit board power module PCB Gold PCB power supply PCB

ltems

Data

Max Layers

FR4,FPC,High-Tg,Halogen-Free,CEM-1,CEM-3.Arlon.Gtek,Isola.

12 Layers

Max Board Size

1200mm×600mm

Board Thickness

0.10mm~3.2mm

Min Board Thickness for Rigid Multi-layer Board

4layers:0.38mm(15mils)

6layers:0.55mm(22mils)

8 layers:0.80mm(32mils)

10 layers:1.00mm(40mils)

Max Copper Thickness

60Z(External)/60Z(Inner)

Min Line Width/Space

0.07mm

Min Hole Diameter

0.10mm

Hole Position Deviation

±0.05mm

PTH hole dia tolearance

±0.076mm

NPTH hole dia tolearance

±0.05mm

Impedance Control Tolerance

±5%(≤50Ω)

±10%(>50Ω)

Board Thickness Tolerance

±10%(>1.0mm)

±8%(<1.0mm)

Max Au Thickness of lmmersion Gold

5u”

Max Au Thickness of Gold Finger

50u”

Min Bridge Width of Solder Mask Layer

5mils

Bent and Twist

≤0.075%

Aspect Ratio

10:01

Insulation Resistance

>1000 billionQNormal

Peel-off Strength

1.4N/mm

Solder Mask Abrasion

>6H

Thermal Stress

280℃10Seconds

E-Test Voltage

250V

V-cut

25/45/60°