High quality copper clad laminates and filler with the Nano ceramic for circuit board, CCL for PCB(F4BTM285)thickness 12.0mm
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- Supplier: Taizhou Wangling Insulating Materials Factory [Jiangsu China]Taizhou
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Product Overview
Description
Teflon woven glass fabric with ceramic filler copper-clad laminates(F4BTM-1/2)
1.Description:
F4BTM-1/2 is laminated by laying up of the varnished glass cloth with Teflon resin and filler with the Nano-ceramic,according to the scientific formulation and strict technology process. This product is better than F4BM in the electrical performance. Meanwhile,the heat dissipation effect is improved and coefficient of thermal expansion is smaller.
Product code des
2.Specifications:
Types | Double side, Single side, Original side |
Dimensions (mm) | 9.84''X11.81''(250X300mm), 11.81''X11.81''(300X300mm), 13.78''X13.78''(350X350mm), 18.11''X24.02''(460X610mm), 19.69''X23.62''( 500X600mm), 35.98''X48.03''( 914X1220mm), 39.37''X48.03''(1000X1220mm), 39.37''X59.06''(1000X1500mm) |
Special dimension can be customized according to customer’s requirement. | |
Dielectric Constant (@10GHZ) | 2.85±0.05 |
Dielectric layer thickness and Tolerance(mm) | 12.0±0.2 |
| For special dimensions,customized lamination is available. | |
Copper thickness(OZ) | 1/2 or 1 or 2 (electrodeposited copper foil) |
Dissipation factor (@ 10GHz) | Less than or equal to 0.0015 |
Copper peel strength (1oz copper) | 18N/cm |
Surface | Condition: Normal state(500V DC) ≥1×10 6 |
| Volume Resistivity(MΩ.cm) | Condition: Normal state ≥1×10 7 |
| Coefficient of thermal expansion(ppm/℃) X Axis Y Axis Z Axis |
Condition: -55℃ to 288℃ 15 15 65 |
Workshop
3.Technical index:
3.1 Mechanical strength & Chemical property
3.2 Electrical property
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