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Solar cell laser Germany ipg silicon wafer/solar cutting machine
[ Technical Parameters ] | |
Model | OLS-20F |
Laser wavelength | 1064nm |
Laser power | 20W |
Scribing width | 30μm |
Scribing speed | 200-300mm/s |
Scribing accuracy | ±10μm |
Working area | 245x245mm |
Temperature control precision | 0.5°C |
Working power | 220V/50Hz/1kvA |
Working table | negative pressure absorbing and dust elimination |
Cooling method | Forced air cooling |


Scribing or cutting the Solar Cells and Silicon Wafers in solar PV industry, including the mono-si (mono crystalline silicon) and poly-si (poly crystalline silicon)solar cells and silicon wafer.

1. Using the Germany IPG FIBER laser or China Raycus Fiber laser or Max fiber laser
service time over 100,000hours.
Stronger adaptability to enviroment
better beam quality and higher speed than Diode Pump and YAG Krypton type.
No need to replace the laser module and Krypton lamp.
2. Work table: X-Y movable
Solar cell can be automatic absoption
3. Air cooling, compact structure, small size
4. Higher conversion efficency,
lower operating cost, save power consumption, cost and shorter maintenance time;
5. Laser Pulse width is more narrow,
Higher peak power, faster scribing cutting speed
6.Long time uninterrupted continuous maintenance-free operation,
no consumable wearing parts to replace
7. Stepper motor or servo motor different cost.





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