mri room copper foil for shielding emi

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Price:$19.00

Quantity:


Product Overview

Description

































Product description



Name 



copper foil



Material



99.8% copper  



Width



standard 1350mm



Thickness



standard 0.105mm(3oz),0.14mm(4oz)



Feature



EMI shielding



Application 



faraday cage,MRI room



Product description:


1.The product structure is based on copper foil as the substrate, conductive acrylic adhesive as the adhesive, plus release paper.


 


2.Three-tier architecture is very suitable for cutter mold or the metal mold die-cutting, Can be flat cutter or round cutter to die-cutting.


 


3.The width of the product available from 3mm ~ 380mm. Standard length is 50m., also do 100m, 150m or longer, save customers the trouble of frequently reloading.
















































Product Features



shielding ED copper foil



thickness 0.009--3mm, width 10-1380mm



easier to make a faraday cage, EMI room



generally 400-500kg/roll



Physical Properties



Density:8.9g/cm³



Electrical conductivity(20°C):min 90%IACS for annealed to temper 80%IACS for rolled to temper min



Thermal conductivity(20°C):390W/(m°C)



Elastic modulus:118000N/m



Softening temperature:≥380°C



Certification



meet the technical conditions GB/T 5187-2008 standards.



in accordance with ISO9001-2000 Quality system requirements


 



images (1).jpgimages (2).jpg


 
















































Product Features



shielding ED copper foil



thickness 0.009--3mm, width 10-1380mm



easier to make a faraday cage, EMI room



generally 400-500kg/roll



Physical Properties



Density:8.9g/cm³



Electrical conductivity(20°C):min 90%IACS for annealed to temper 80%IACS for rolled to temper min



Thermal conductivity(20°C):390W/(m°C)



Elastic modulus:118000N/m



Softening temperature:≥380°C



Certification



meet the technical conditions GB/T 5187-2008 standards.



in accordance with ISO9001-2000 Quality system requirements































































































































Part Number



Backing Material



Thickness of Backing (mm)



Total Thickness (mm)



Holding Power Min/inch



Adhesion Strength kg/25mm



Adhesive Component



Shield Efficacy 10MHz~ 1GHz (dB)



Conductivity z-ohms



Integrated thermal conductivity (W/mK)



XPH0M123



Copper Foil



0.012



0.030±0.01



≥1440



>0.8



Acrylic



≥60



<0.03



60



XPH0M183



Copper Foil



0.018



0.050±0.005



≥1440



>1.0



Acrylic



≥60



<0.03



60



XPH0M253



Copper Foil



0.025



0.06±0.005



≥1440



>1.0



Acrylic



≥60



<0.03



80



XPH0M353



Copper Foil



0.035



0.070±0.005



≥1440



>1.0



Acrylic



≥60



<0.03



90



XPH0M503



Copper Foil



0.050



0.085±0.005



≥1440



>1.0



Acrylic



≥60



<0.03



110



XPH0M753



Copper Foil



0.075



0.11±0.01



≥1440



>1.0



Acrylic



≥60



<0.03



130



XPH0MA03



Copper Foil



0.100



0.135±0.01



≥1440



>1.0



Acrylic



≥60



<0.03



160



XPH0MA23



Copper Foil



0.125



0.15±0.015



≥1440



>1.0



Acrylic



≥60



<0.03



170



XPH0MA53



Copper Foil



0.150



0.20±0.02



≥1440



>1.0



Acrylic



≥60



<0.03



190


 



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0.196 s.