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SPECIFICATION:
1.CONTACT RESISTANCE: 50mΩMAX
2.INSULATION RESISTANCE:100MΩ MIN
3.DIELECTRIC STRENGTH:NO DAMAGE TO PARTS ARCING,OR BREAKDOWN ETC.
4.PRACTICAL TEMPERATURE RANGE:AT-16℃~+125℃
5.SOLDERABILITY TEST:THE TOP OF THE TERMINALS SHALL BE DIPPED 2mmINTHE SOLDER BATH OF 230+10℃ FOR 3+0.5 SECONDS.
6.RESISTANCE TO SOLDERING HEAT TEST:SOLDER BATH METHOD:SOLDER TEMPERATURE260+5℃,IMMERSION TIME5+0.5SEC,IMMERSION DEPTH UP TO THE SURFACE OF THE BOARD,DIMENSIONS OF COMPONENT HOLES IN THE PRINTED WIRING BOARD SHALL BEING ACCORDANCE WITH THOSE SPECIFIED IN THIS SPECIFICATION.

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