High Temperature pb92.5sn5ag2.5 solder paste for re flow soldering, semiconductor
- Category: >>>
- Supplier: Shenzhen Jufeng Solder Co. Ltd.
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Product Overview
Description
High Temperature solder paste, No clean pb92.5sn5ag2.5
Melting Point: 287~296℃
JF-800920 high-lead solder paste is made of high-reliability soldering flux and high-quality, high
sphericity, uniform particle distribution and low oxide content alloy powder of Sn5/Pb92.5/Ag2.5.Its high
reliability flux is scientifically compounded of polymer film forming agent, modified resin, organic
activator and polymer alcohol ether solvent. It is high-lead and high melting point alloy meeting RoHS
Exemption Ordinance. It usually applies to power semiconductor and other components packaging and
welding. The alloy has good compatibility with gold, copper and silver with high welding strength and
residual impedance. This solder paste has good printing fluidity and good solderability, less residual after
welding, and high insulation resistance.
Features
- The product is high temperature solder paste with lead content higher than 85wt%. It belongs to
- RoHS exempt solder paste. It is specially used for power semiconductor packaging and welding,
- mainly power transistor, diode, triode, rectifier bridge, small integrated circuit and so on. It can
- meet all kinds of dispensing and printing process.
- Excellent wetting, transparent and colorless residual after welding. Excellent adhesion, not easy to
- dry. Excellent dry resistance. Suitable for high temperature welding; melting point 280 degrees,
- suitable for welding 320-350 high temperature wafer welding process.
- Smooth and stable in automatic dispensing, little variance of viscosity and output.
- Stable chemical properties meets long time dispensing and printing requirement.
- Good solderability, easy to clean residue, high on-line yield and minimal porosity of solder joints;
- ROHS exemption solder paste
Application
JF-800920 solder paste meets the requirements of automatic dispensing process, can be used for high-
temperature working devices, high-density integrated circuit packaging and welding of circuit boards requiring
2nd reflow. For example, it has good application effects in the fields of hybrid integrated circuits, semiconductor
integrated circuits, filter devices, microwave devices, high-power devices, connectors, sensors, metal or
Ceramic enclosures of photoelectric devices and other special electronic components such as metal enclosures
or ceramic enclosures.
Precautions
- Stored in a sealed container at 0~10℃. Shelf life: 6 months
- Do not mix water and other substances into the solder paste. Keep working environment, tools, materials that
- contacting solder paste clean and dry, or it might cause solidification and NG
- It should be used up within three days after unsealing. Do not expose it into air for long time, put the remaining
- solder paste in a separate container, do not mix with fresh solder paste.
- Other precautions refers to MSDS
Package and Storage
Package
Standard Pacakge: 500g/jar
Syringe package: 30g/syringe, 200g/syringe or according to clients’ requirement
Storage: keep it sealed. 6 moths warranty since production
Soldering
1. Bake: Bake 60~90 minutes at 320℃ in the oven. Adjustment according to specific process
2. Reflow
2.1 Printing
Recommended printing parameters for JF-800920 solder paste as follow
a. Scraper: stainless steel scraper or polyurethane scraper
b. Printing speed: up to 100mm/sec
c. Temperature/humidity: 25+5 C, 50+10% relative humidity
d. Service life of steel mesh: The dwell time of solder paste on stencil is more than 8 hours.
2.2 flow chart
Leadfree solder paste
Lead Free Solder Paste | Melting Point | Particle Size |
| 217℃ | 3#, 4#, 5#, 6#,7# |
Sn96.5Ag3.0Cu0.5
| 217℃ | 3#, 4#, 5#, 6#,7# |
Sn96.5Ag3.5 | 222℃ | 3#, 4#, 5# |
| 217℃ | 3#, 4#, 5# |
Sn99Ag0.3Cu0.7
| 217℃ | 3#, 4#, 5# |
| 217℃ | 3#, 4#, 5# |
| 172℃ | 3#, 4#, 5# |
| 138℃ | 3#, 4#, 5# |
| 250℃ | 3#, 4#, 5# |
| 240℃ | 3#, 4#, 5# |
Lead Solder Paste | Melting Point | Particle Size |
| 96℃ | 3#, 4#, 5# |
| 179℃ | 3#, 4#, 5# |
Sn62Pb36Ag2 | 179℃ | 3#, 4#, 5# |
| 183℃ | 3#, 4#, 5# |
Sn63Pb37 | 183℃ | 3#, 4#, 5# |
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