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CAS No.: 68891-50-9
MF: C21H27N3X2
Components of epoxy resin binders, composites and coatings radially cured and intermediates of epoxy acrylic esters used in photopolymer printing plates.
Item | Index |
Density | 1 g/mL at 25 °C |
Refractive Index | n20/D 1.516(lit.) |
Flashing Point | >230 °F |
The metallic adhesive made from epoxy resin which is modified by CTBN (acrylonitrile content is 25%), has good toughness, flexibility and fatigue resistance. It can be used to bond the components of plane, as well as organic glass and terylene belt. This adhesive also can be used as seeping adhesive of various cloth materials such as glass fiber, terylene and carbon fiber.
The adhesive which is produced from CTBN and epoxy resin can curing at normal temperature, can be used to bond aluminous materials, it will reach the highest adhesive intensity after 72 hours. The peel- intensity is 0.55MPa, and the cutting intensity is 26.7MPa. the electric element sealant material produced by CTBN modified epoxy, which enhance the cracking resistance ,will have no crack after 200 times recycling at the temperature between -55.0℃ to 150℃ . The CTBN can be used as adhesive in grind and cutting wheel, it has the benefits of less adhesive but more abrasion resistance, as well as the performance of good polish, hot water resistance.






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