Porous Vacuum Chuck Table magnetic table For Semiconductor Wafer on Dicing Saw

Product Overview

Description

disco machine use 6 inch magnetic chuck table

 

Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes. The back grinding chuck tables and dicing chuck tables work well with Japanese, German and Chinese dicing saws and back grinding machines, thus ensuring an excellent cost effectiveness..we export these series chuck to Japan,Germany and some other countries.

 

Features

 

1. This wafer chuck provides a high flatness and depth of parallelism.

2. It is compact in structure, uniform size and high strength.

3. It features a well-distributed absorption capacity.

4. The dicing accessory is easy to dress.

 

Applications

 

6, 8 and 12 inch semiconductor wafers

 

Applicable Machines

 

Back grinding machines, dicing saws, DISCO DFD641

 

Type

 

Ceramic,Metal

 

INSPECTION OF 6"MAGNETIC TYPE CHUCK TABLE

 

STANDARD PLANENESS	0.003			16 POINTS MEASURED	MAX 0
					MIN -0.003
SURFACE PLANENESS	0.004			16 POINTS MEASURED	MAX +0.0035
					MIN 0
SURFACE PARALLELISM	0.005			0.004
NO MEMBRANE SUCTION	≥-25			-15
SUCTION	≤-85			-88

More picture for you review

 

We also have different kind of dicing blade, photo as below:

 

Below is our dressing board for dicing blade: