Почти Непрерывная волна 1064 нм с активным охлаждением лазерных диодов (LD)

- AuSn hard-solder package, higher stability
- Higher power conversion efficiency
- Macro channel package, sealed house
- Higher reliability, longer life time
-Up to 50W QCW per Bar
-2.0 mm pitch between Bars
-Up to 6-16 Bars in a single stack module
-Single or multi-wavelength 760nm, 808nm, 1064nm in a single stack module
-Active water cooling for optimized lifetime and power
-Low thermal resistance package

1.Avoid eyes or skin exposure to direct or scattered radiation in case of laser working

2.Anti-static measures must be taken when transporting, storing and using

3.Use constant current power supply to avoid surge when working

4.Used under rated current and rated power, otherwise reduce lifetime 

5.Maintain good thermal dissipation during laser operation

(1) Hard solder sintering process, which effectively prevents the problems that have occurred in indium solders-creep, electromigration and thermal fatigue of indium solder, to improve its reliability, stability and long lifetime.

(2) Optimizing the design of water channel and packaging structure, and adopt high-efficiency material with high thermal conductivity, low expansion coefficient, high temperature resistance, corrosion resistance and oxidantion resistance, effectively improve the heat dissipation capability of the laser, ensure higher output power of the laser bar & stability & longer lifetime.