High Precision on Line 3D SPI Equipment for SMT I RISON I
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- Supplier: Shenzhen Rison Automation Co. Ltd. [Guangdong China]Shenzhen
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Product Overview
Description
RX-SPI80 Online Solder Paste Inspection
PRODUCT FEATURE
5 Mega pixel high resolution vertical&side camera,
Effectively reducing shadow effect,enhancing accuracy
Of measurement to paste coverage and thickness
User friendly software interface
FOV 32mm x 32mm,<0.60sec/FOV
Mixed long&short wave length Mollweide projection technology
On screen display actual formed images
4 color round shape light source
Height measurement accuracy in+—1um
SMEMA upstream/downstream interface
Gerber file input compatibility
The meaning of online SPI
PRODUCT FEATURES
SPI phase measurement technology
The grating phase light source used, the distortion generated by different height planes, the detection head continuously moves in a certain direction, the camera takes photos at set time intervals, thereby obtaining a set of laser distortion data, and then calculating to obtain the test result..
Software control of the grating motion is realized, which avoids the mechanical devices necessary for the traditional piezoelectric ceramic motor (PZT) to drive the glass moiré grating, reducing mechanical wear and customer maintenance costs.
16-bit grayscale resolution, up to 0.3 micron detection resolution, 2 orders of magnitude better than laser measurement accuracy, greatly improving the detection capability and scope of the device.
In order to avoid poor printing during the test, 3D SPI detection is required.
Solder judgment result
Area | Volume | ICT | |
2D inspection machine | OK | - | NG |
3D inspection machine | OK | NG |
Self-developed software
Self-developed 3D-SPI software
PRODUCT FEATURES
Name | SPI Solder Paste Inspection Machine |
Model | RX-3DSPI-80 |
Camera | Full digital high speed CCD camera, 5M Pix |
Light source | Ring LED light source |
FOV | 32mm*32mm(20μm) |
Speed Per FOV | <0.6s |
Detect type | Solder paste / Red glue pringting: Volume, Area, Height,Shape, Offset, Bridge, Overflow |
Defect type | None, Offset, More, Less, Bridge, Tip, Collapse, Shape, Gold finger, Insufficient height, Height excess, Overflow, Lack of glue |
Height Range | 10~400um |
Area Range | Min : 0.15mm×0.15mm Max : 10mm×10mm |
Height detection accuracy | 1μm |
Volume/Area/Height Repeatability on a Certificated Target | <1μm@3sigma |
GR&R | <10% |
Operating system | Windows 7 |
Recognition system | Dual 3D Projection(Single optional)avoid shadow and reflection |
Operation interface | Graphical programming, easy to operate, can switch English, traditional, simplified system |
Interface display | 2D/3D true color picture |
MARK | 2 Marks/Board or 2 Marks/Array, support bad mark |
software program | Gerber, CAD data, Offline program,Bare Board Teach |
SPC Chart | Any time Chart |
Histogram / Control/ Compare Chart | Volume, Area, Height, Offset |
Export | Excel , Jpg , Bmp |
PCB Transmit System | Bottom-up fix; Auto transmit and width correct based on SMEMA |
Height | 900±20mm |
PCB Size | Min : 50mm×50mm Max : 330mm×250mm |
PCB Thickness | 0.3mm~4.5mm |
Max PCB Warp | <2mm |
Motion | AC servo motor system |
X, Y platform position accuracy | <1μm |
Speed | 700mm/s |
Power supply | AC220V 50/60Hz,1200W |
Air pressure | 0.4~0.8Mpa |
Barcode scanning function | Camera direct scanning, optional external barcode gun |
Dimensions | 1565×1250×1565mm (L×W×H) does not include the height of the signal light |
Equipment weight | 900KG |
For further information please feel free to contact me.
//www.rison-aut.com/en/
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