Share on (62407510006):


Item | PCB/PCBA/FPCB |
Finished surface | Conventional HASL, Lead-free HASL, Falsh Gold, ENIG(Immersion Gold), Osp, Immersion Tin, Immersion Silve |
Base Material | FR-4(shengyi China, TEQ, KB A+. HZ))/ High TG FR-4 / Rgon/sola//Rogers/Arlon/Taconic/Teflon |
Layers | 1-40 |
Finised inner/outer copper thickness | 0.5-6OZ |
Finished board thickness | 0.2-7.0mm |
Technical specification | Min line width/gap: 3.5/4mil(laser drill) Min hole size: 0.15mm Min Annular ring: 4mil Max copper thickness: 6OZ Max production size: 900*1200mm Board thickness: D/S: 0.2-7.0mm, multilayers: 0.40-7.0mm Min solder mask bridge: ≥0.08mm Aspect ratio: 15:1 Plugging Visa capability: 0.2-0.8mm |
Controlled Impedance | +/-5% |
Plugging vias capability | 0.2-0.8mm |
Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
Tolerance | Plated holes Tolerance: ±0.08mm(min±0.05) Non-plated hole tolerance: ±0.05mm(min+0/-0.05mm or +0.05/-0mm) Outline tolerance: ±0.15mm(min±0.10mm) Functional test: Insulating resistance: 50ohms Peel off strength: 1.4N/mm Thermal stress test: 2650c, 20 seconds Solder mask hardness: 6HE-test voltage: ≥00V+15/-0v 30s Warp and twist: 0.7%(semiconductor test board ≤.3%) |









New products from manufacturers at wholesale prices