Vacuum Plasma Asher painting, gluing or bonding

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Price:$80,000.00

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Product Overview

Description


Product Description

 

Production Description
Creating Nano PC01/PA03B low pressure plasma cleaner system can be used for the fast removal of residual photo resist on wafers and clean the wafer surface with etch rates that are the highest in the industry.
Product Features
.Extremely high plasma uniformity
.No substrate damage due to the use of low energy ions
.No contamination of substrates or electrodes
.Special plasma electrode design
.High density plasma source
.High efficiency plasma
.Combined chemical reactions and physical bombardments
.Well-controlled low ion energy
.High cleaning efficiency
.Ample operating conditions
.Multiple processing gases selectivity for surface cleaning and treatment
.Fully automatic and user-friendly
.High reliability and easy maintenance
.Customization

 

 
Related solutions

.Surface cleaning and modification for LCD, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED Packaging, SMT, PCB, FPC, etc.

.Improving surface roughness before printing, painting, gluing or bonding

 

 

 

Specification

 

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Award

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The exhibition

 

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Q: Are you trading company or manufacturer?

A: We have our own Equipment  factories.

Q: Why choose us?

A: We have a lot of experience, enable us to suggest you the best solution.

Q: How do you make our business long-term and good relationship?

A:1. We keep good quality and competitive price to ensure our customers benefit ;
    2. We respect every customer as our friend and we sincerely do business and make friends with them,
no matter where they come from.

 

 


0.2025 s.