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Item | Capabilities |
Monthly capability | 25000sqm/month |
Layer | 1-14 Layers |
Board material | FR-4 Tg130 / FR-4 tg140 / FR-4 Tg150 / FR-4 Tg170 / FR-4 Tg180 |
/FR-4 CTI175 / FR-4 CTI300 | |
Surface treatment | HASL / RoHS-HASL / Immersion gold / Plating gold / Gold fingers / OSP |
Solder mask colour | Green / Blue / Red / Black / Yellow / White |
Silk screen colour | White, Black, Yellow |
Tolerance | Board thickness tolerance / Board thickness≤1.0mm: +/-0.1mm / |
Board thickness 1.0-2.0mm: +/-10% / Board thickness >2.0mm: +/-8% | |
PTH diameter tolerance: +/-0.075mm / NPTH diameter tolerance: +/-0.05mm | |
/ Hole location tolerance: +/-0.075mm | |
Outline tolerance / Length≤100mm: +/-0.1mm / Length 100-300mm: + | |
/-0.15mm / Length >300mm: +/-0.2mm | |
V-cut dept tolerance: +/-0.1mm | |
Technical Specification | Min line width/space: 0.075/0.075mm |
Min PTH copper thickness: 20um | |
Min hole diameter: 0.2mm | |
Min pad ring: 0.1mm | |
UL certified max copper thickness: 6oz(including Multilayer, double layers | |
and single layer boards) | |
Max board size: 560*410mm | |
Board thickness / Double-sided board: 0.2-7.0mm / Multilayer board: 0.4-7.0mm | |
Solder mask bridge: ≥0.08mm | |
Aspect ratio: 8:1 | |
Via plugging capacity: 0.2-0.6mm | |
Board bow and twist: ≤0.75% | |
Au, Ni, HASL thickness: 1, Immersion gold: Au 1-4u” / 2, Gold fingers: Au 1-50u” | |
/ 3, Plating gold: Au 1-5u” / 4, Ni thickness: 100-200u” / 5, HASL thickness: | |
1-50um / 6, OSP thickness: 0.3-0.5um |
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