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Microwave PPO copper clad substrate with ceramic (TP300)
1.Advantages:
(1)The dielectric constant is stable and can be optional within the range of 3~25 according to the design of circuit requirement;
(2) The adhesive power between the copper and the substrate is more reliable than the vacuum film coating of ceramic substrate;
2.Specifications:
Types | Double side |
Dimensions A×B(mm) and Tolerance(mm)
| 6''x6''(150×150mm), 6.3''x6.3''(160×160mm), 7''x7''(180×180mm), 8''x8''(200×200mm), 6.7''x9.4''(170×240mm) |
-2 | |
Thickness(including two-sided copper) and Tolerance(mm) | 1.5±0.06 |
Special thickness can be customized. | |
ED Copper thickness(OZ) | 0.5 or 1 |
| Dielectric constant(DK) | 3.0±0.06 |
| Special dielectric constant can be customized. | |
Dissipation factor (@ 10GHz) | Less than or equal to 0.001 |
Copper peel strength (1oz copper) | Condition: normal state ≥6N/cm |
Surface Resistivity (MΩ.cm ) | ≥1×107 |
Volume Resistivity (MΩ.cm ) | ≥1×109 |
| Coefficient of thermal expansion(ppm/℃) X Axis Y Axis Z Axis |
Condition: -55℃ to 288℃ <40 <40 <60 |

3.Technical index:

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