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Features20 parallel channel
SMT type with stamp hole
TCXO design
| General | |
| Temperature | Operating : -40 ~ +85°C Storage : -40 ~ +85°C |
| Dimension | 13 x 15.2 x 2.2mm |
| Weight | 3.5g |
| Voltage Type | 3.3V±5% |
| RoHS | Supported |
| I/O pin | 22pin stamp holes |
| Specification | |
| Chipset | SiRF Star III, GSC3f/LPx (Digital, RF in a single package) |
| Frequency | L1, 1,575.42 MHz |
| Channel | 20 parallel |
| C/A Code | 1,023 MHz |
| Chip set TTFF | Reacquisition: less than 1s Hot start: less than 1s @ open sky Warm start: less than 35s @ open sky Cold start: less than 35s @ open sky |
| Accuracy | Position: within 10m for 90% Velocity: 0.1m/s |
| Interface Protocol | 1. NMEA 0183 ver 3.0, GGA, GSA, GSV, RMC, 4800bps 2. SiRF Protocol 57600bps, 8 data bits, no parity, 1 stop bits |
| LNA | 15dB Gain.(Typ.) LNA only enable by LPX series |
| Internal Memory | Flash type on 4Mb |
| TCXO | 16.369MHz |
| Trickle Power Mode | Duty cycle 34%. (Variable) Default: disable (option: enable) |
| DGPS | WAAS, EGNOS, MSAS |
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