Неочищенная Оловянная всасывающая лента для ремонта паяльных соединений и капель 3515/3015/2015/1515 печатной платы

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Product Description


The tin suction tape is a braided metal wire tape that can absorb molten solder by capillary action. It is used to absorb excess solder when removing tin, is resistant to oxidation and corrosion, has good thermal conductivity and clean tin absorption. Remove the desoldering points of the motherboard and use it with the soldering station.
The tin strip is refined with pure copper and special chemical formula to ensure fast, good and economical. It is used to absorb excess solder when removing tin, is resistant to oxidation and corrosion, has good thermal conductivity and clean tin absorption.In desoldering, after the chip is removed, there will be a large amount of solder on the circuit board, which will affect the soldering of the chip. The soldering tape is usually used for cleaning. The method is to put the soldering iron on the soldering tape and slowly move it on the chip pad. When the solder is melted, it will be sucked up by the soldering tape. The board is very clean. Afterwards, it is best to wash the chip position of the machine board thoroughly with washing water. Suction tape can be used for larger SMD components! In the tin removal tool, the tin suction device can be used for general aluminum electrolytic capacitors, and the tin suction tape can be used for larger SMD components. No cleaning, cut off the sucked section after each use and reuse it.




Specification


we also have service for PCB and PCBA , Kindly check the following information if you have any request, please contact us freely !


Layer count
1-28L,HDI
Material
FR-4, High TG FR4, aluminium, FPC
Teflon,PTFE (F4B,F4BK), Rogers (4003,4350,5880)
Max board dimensions
800mm*620mm
Board shape
Rectangular,round,slots,cutouts,complex,irregular
Board type
Rigid,flexible,rigid-flexible
Board cutting
Shear,V-score,tab-routed,counter sunk
Board thickness
0.2~8.0mm, Flex 0.1~0.25mm
Thickness Tolerance
±10%
Min line width / space
3mil/3mil
Minimum Drilling Hole (Mechanical)
0.1mm
Minimum laser hole
0.075mm
Blind Hole/buried plate
YES
Hole Position/hole Tolerance
PTH:±0.076MM
NPTH:±0.05mm
InnerLayer Copper Thickness
0.5-3 oz
OutLayer Copper Thickness
0.5-4 oz
Impedance control tolerance
±10%
Surface finish
HASL,Lead free HASL,ENIG,Immersion Tin,Immersion Silver,OSP...
Solder mask
Double-sided green,red,white,blue,black,etc
Silkscreen
Double-sided or single-sided in white,black,or negative
PCB Testing
E-test, Flying probe test
Acceptable File Format
Gerber RS-274X,274D,AutoCAD'S DXF,DWG,Pro-E,Ki-CAD
Quality Standards
IPC-A-600F and MIL-STD-105D CHINA GB<4588>


Types of PCB assembly
SMT (Surface Mounted Technology)
THT (Through Hole Technology)
Mixed (surface mount and through hole) technology
Cable assembly
Component
Passive Component: small as 01005, 0201
BGA, uBGA, QFN, POP, SOP,SSOP,PLCC,LGA
Fine Pitch Parts: 0.25mm fine pitch parts
Max Component Height: 25mm(SMT), Top 120mm/Bot 15mm (Wave-Solder)
Component Package
Reels, cut tape, Tube and tray, Loose parts and bulk
Board Dimension
Min Board Size: No Limited
Max Board Size: 680 x 500mm
Board Shape
We can assemble boards in Rectangular, Circular and irregular
Board Type
Rigid PCB, Flexible PCB, Rigid-flex PCB
Assembly process
Leaded
Lead-Free (RoHS)
Design file format
Gerber RS-274X
BOM (Bill of Materials) (.xls, .csv, . xlsx)
Centroid(Pick-N-Place/XY file)
Electrical testing
X-ray Inspection
AOI (Automated Optical Inspection)
Functional testing
Certificate
ISO13485, IATF16949, ISO9001,ISO14001
Quality Standards
IPC-A-600/IPC-A-610 compliance
Type of Service
Turn-key, partial turn-key or consignment
Sub-assembly
Plastic case,metal case,screen
Silkscreen
Double-sided or single-sided in white,black,or negative
PCB Testing
E-test, Flying probe test
Acceptable File Format
Gerber RS-274X,274D,AutoCAD'S DXF,DWG,Pro-E,Ki-CAD
Quality Standards
IPC-A-600F and MIL-STD-105D CHINA GB<4588>


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