Капиллярная проволока nozzel хорошего качества для ремонтных машин

Сохранить в закладки 1600274426709:


Цена:70,00 $ - 80,00 $*

Количество:

  • В избранное

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Характеристики



Product Description




In recent years, wire bonding package interconnect technology has shifted gears from gold to copper. The interest to use Ag alloy wire as an alternative wire bonding material has been explored for further process improvement in terms of bonding sensitive metallization devices that cannot be bonded using a hard but cheaper copper wire. However, second (stitch) bond associated to the change in wire properties has been one of the most common wire bonding related problems that cause poor productivity and low Mean-Time-Between-Assist (MTBA).
To achieve an optimal stitch formation and reliable bonding using Ag alloy wire, SPT's Stitch Integrator (SI) capillary is the recommended working solution proven to enhance the coupling interface between the capillary tip surface and the Ag alloy wire as it provides the most efficient ultrasonic energy transfer.
SI Features
Enhanced coupling effect between the capillary and wire with better ultrasonic energy transfer versus conventional finishing.


Superior wire pull failure mode with comparable result as AU wire bonding.



Extended Capillary Tool Life
Typical cause of short tool life using Ag alloy wire is due to heavy load-up of foreign materials at the tip surface of the SI capillary. To overcome this problem, it is highly recommended to integrate the Infinity feature which increases the capillary touchdown.


Ag Alloy wire bonding - 1.5kk bonds
Capillary build up issue



                         VBN taper design                                                                                 Deep access wire bonding



Capillaries for special deep access types of packaging application are available. The uniqueness of the taper design is dependent upon the die and package orientation. These capillaries provide vertical clearance between adjacent high loop profile and die edge.






Company Profile


Shenzhen Weichen Technology Co., Ltd. set up in 2019, specialized in manufacturing electronic equipment, automation equipment, semiconductor photoelectric equipment, hand-bonding machine, the series of gold wire ball welding machine and aluminum wire bonding machine, also researching and selling of electronic accessories, offering planning of package collective scheme and importing and exporting of equipments and technology.There is a group of high-educated specialists, experienced engineers, and staffs with excellent professional skills in Shenzhen Weichen Technology Co., Ltd. Our goal is to provide our clients high performance product and exceeded service but low price. We maintain so good relationship with the all kind of university and scientific research institution that we know the newest bonding (welding) technology direction all over the world, committed to give out the best connection (welding) solution to our global customer.We bring our customers not only reliable products and technology, but also excellent services and application solutions. We are happy that we are trustworthy by the clients who bought our machines from all over the world. We are happy that we bring value to our client.


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FAQ


Q1. What is the advantage about your company?
A1. Our company has professional team and professional production line.

Q2. Why should I choose your products?
A2. Our products are high quality and low price.

Q3. The logo and the color can be customized?
A3. Yes, we welcome you to sample custom

Q4. Any other good service your company can provide?
A4. Yes,we can provide good after-sale and fast delivery.


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