Автоматический штамповочный станок с ручной загрузкой и понижением нагрузки/цифровая трубка/встроенный светодиод/поверхностное крепление SMD/COB

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Product Description


Automatic loading and unloading crystal fixing machine
Fully automatic loading and unloading, suitable for SMD, 1W and integrated high-power COB surface light source, triode and other flat support products
Modular design, new optimized layout, focus on quality, with the best stable performance
You can flexibly choose different configurations such as four crystal rings, double dispensing heads, double glue plates, 25cm long brackets, etc., to create the most suitable products for customers
Brand-new tying head design, fast die bond cycle up to 180ms




Specification


360-8 inch wafer bonding machine technical specifications
Solid crystal workbench (linear module)
Optics System
Workbench stroke
450x220mm
Camera
Resolution
1μm
Optics Magnifier
0.7 times ~ 4.5 times
Epistar Workbench (Linear Module)
Cycle Time
200MS/EA
XY stroke
8"*8"
Die bond cycle
Less than 250 milliseconds
Resolution
1μm
Production capacity
Greater than 12k
Accuracy of wafer placement
Loading and unloading module
Manual loading and unloading
Stick position x-y
±2mil
Rotation accuracy
±3°
Dispensing module
Equipment Require
Use swing arm dispensing + heating system
Voltage
AC220V/50HZ
The dispensing needle group can be interchanged with single needle or multiple needles
Air Source
At least 6BAR
Vacuum Source
700mmHG
Power Consumpion
3000w
PR System
Dimensions And Weight
Method
256 grey levels
Weight
450kg
Detection
Ink/chipping/cracked die
Size(DxWxH)
1200*900*1500mm
Monitor
17" LCD
Monitor Resolution
1024*768
Missing Die
Vacuum Sensor


380-12 inch wafer bonding machine technical specifications
Solid crystal workbench (linear module)
Optics System
Workbench stroke
100x300mm
Camera
Resolution
1μm
Optics Magnifier
0.7 times ~ 4.5 times
Epistar Workbench (Linear Module)
Cycle Time
200MS/EA
XY stroke
12"*12"
The die bonding cycle is less than 250 milliseconds,
and the production capacity is greater than 12k;
Resolution
1μm
Accuracy of wafer placement
Loading and unloading module
Stick position x-y
±2mil
Automatic feeding method using vacuum suction cup
Unloading using the material box container type receiving material
Use pneumatic pressure plate type clamp, the width of the bracket can be adjusted in the range of 25~90mm
Rotation accuracy
±3°
Dispensing module
Equipment Require
Use swing arm dispensing + heating system
The dispensing needle group can be interchanged with single needle or multiple needles
Voltage
AC220V/50HZ
Air Source
At least 6BAR
Vacuum Source
700mmHG(Vacuum pump)
Power Consumpion
3000w
PR System
Dimensions And Weight
Method
256 grey levels
Weight
450kg
Detection
ink /chipping/cracked die
Size(DxWxH)
1200*1200*1500mm
Monitor
17" LCD
Monitor Resolution
1024*768


Bonding arm
Bonding arm
90 degree
Motor
AC servo moto
Wafer work stage
Stroke
6"*6"
resolution
0.2 mil (5μm)
Lead frame wore stage
Lead frame number
1PC
Stroke
10"*6"
Resolution
0.2 mil (5μm)
Die and wafer
Die dimension
5mil*5mil~100mil*100mil
Wafer dimension6
6
固晶精度
旋转精度:±3°
放置精度:±1.5mil
固晶压力
25g~35g
单晶片处理能力
多晶元设计
Ejector system
Sync with the part
Can adjust the height
Epoxy picking system
Epoxy picking arm
Rotary type
moto
AC servo moto


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