SE8307 2 SMT эпоксидный клей красный для SMD Светодиодная лампа с составным PCB stentil печать

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Характеристики


SE8307 is one component epoxy adhesive and a kind of heat cured adhesive. It designed for stencil printing . High bonding strength, high humidity-intensity, excellent electrical performance and good storage stability


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Typical Usage


Mainly used for the bonding of the mounted components on SMT.


 


Properties Uncured 


 















































 Typical ValueRangeTest Standard
AppearanceRed cream  
Chemical TypeEpoxy Resin  
Viscosity (Pa.s) (Brookfield RV) Spindle 500-800GB/T 2794-1995
Thixotropic index5.6  
Density (g /cm3 )1.35           1.55-1.65       GB/T  13354-1992

Operate Time at Room Temperature


(day@25°C)                      


 14  

 


 


Curing Condition Recommended


90-120s at 120°C.


60-90s at 150°C


 


The product will obtain to higher bonding strength when higher curing temperature and longer cured time . the figure curve is the recommended curing temperature and heating rate,Underthe corresponding temperature ,components need the time when they achieve good bonding strength.


Users can set the curing furnace’s temperature parameters according to the solidified characteristic curve of the glue and the heat efficiency of the Reflow Ovens


 


Performance After Cured


(Cured for 30min@150°C)


 


Physical Property                            



































 Typical ValueTest Sstandard
Hardness ( ShoreD )81  GB/T2411-1980
Shear Strength(MPa) 14.8   GB/T7124-1986
Tg(°C)(DSC)   98  ASTM E1545
Dielectric strength(KV/mm)    27.5 GB/T408.1-1999
Surface resistance (Ω)   3.4×1016                 GB/T1410-2006                  

 


Heat strength


(30min at 150°C)


Shear Strength(MPa)AL-AL


  


Direction For Use


The product should be recovered to room temperature before use, don't open the aluminum foil package before recovered to room temperature(the recovering time of 300ml packaging at least 2-4 hours).


The product should be used at 25°C ,


The glue viscosity will decline under the higher temperature, which influence printing effect; High humidity can increase the glue of moisture absorption which shorten the opening hours of the glue and influence the glue bonding strength. This product opening time is 48 hours at 25 °C,55% Rh.


Suggest to print at the speed of 20-150 mm/s; Drawknife pressure is 3-4 N/cm (Afer scraping, sheet should be clean, and avoid producing wire drawing); the deviating speed from the sheet is 0.1 3.0 mm/s.


Not cured adhesive which is stick on line wires can be erased with acetone or propylene alcohol ethers.


please seal and chill when not using up the glue.


 


Notice


Keep away from children. 


The workshop should be adequate ventilation.


Wash with soapy water if on skin.


Wash with a lot of soapy water and then go for doctor if in eyes.


For more information, please refer to MSDS.


 


Package


NO: 6414034 300ml


NO: 6414054 200ml


 


Storage


6 months sealed at 2-8°C.


 


SMT red adhesive  


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