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SoM FET3568-C Features |
CPU | Rockchip RK3568 quad-core Cortex-A55@2.0GHz |
GPU | • Mali-G52-2EE |
• OpenGL ES 1.1, 2.0, 3.2, Vulkan 1.0,1.1, OpenCL 2.0 | |
NPU | 1TOPS, Support INT8/INT16/FP16/BFP16 mixed operation. |
VPU | Decode: |
• H.264, H.265, VP9: up to 4096x2304@60fps | |
• VP8: up to 1920x1088@60fps | |
• VC1, MPEG-4, MPEG-2, MPEG-1: up to 1920x1088@60fps | |
• H.263: up to 720x576@60fps | |
Encode: | |
H.264/AVC, H.265/HEVC: up to 1920x1080@60fps | |
RAM | 2GB |
Flash | 16GB eMMC |
Working Temp | 0℃ to +70℃ |
Dimensions | 45x 70mm |
Voltage Input | DC 5V |
OS | Linux4.19+Qt5.12, Android11* |
Display | 3 |
3 display controllers which can support simultaneous output of any 3 combination in RGB, LVDS, MIPI DSI, HDMI and eDP | |
• RGB: RGB888, resolution up to 1280x800; | |
• LVDS: single-lane output, up to 1280x800, multiplexed with MIPI-DSI0; | |
• MIPI-DSI: single-lane output, up to 1920x1080@60Hz; dual-lane output up to 2560*1440@60Hz; | |
• HDMI: up to 1080p@120Hz or 4096x2304@60Hz; | |
• eDP: eDP 1.3, up to 2560x1600@60Hz; | |
Audio | 1X 8ch I2S/TDM, 2X2ch I2S, 1x8ch PDM. |
Camera | 1x 4-lane MIPI-CSI |
1x DVP | |
SDIO | SDIO 3.0, throughout up to 104MB/S |
Ethernet | 2x GMAC by RGMII/ RMII |
USB2.0 | 2x USB2.0 Host(separately, but not multiplxed with USB3.0) |
USB2.0 | 1x USB2.0 Host, 1x USB2.0 OTG, could be configured to USB2.0 contained in USB3.0, when USB3.0 is not needed, it could be used as 2 separate USB2.0 |
USB3.0 | 2, 1x USB3.0 Host, 1x USB3.0 OTG |
SATA | SATA3.0, up to 6.0Gb/ s, supports eSATA |
PCIe2.1 | 1, up to 5.0Gbps, RC mode |
PCIe3.0 | 2x PCIe 3.0 |
1x 2-lane or 2x 1-lane, each lane up to 8.0Gbps | |
1-lane can only support Root Complex(RC) mode | |
2-lane can support both Root Complex(RC) mode and End Point(EP) mode | |
UART | 10, up to 4Mbps |
CAN | 3, supports CAN-FD and CAN2.0B |
SPI | 4, host mode and slave mode are configurable |
IIC | 5, supports 7-bit and 10-bit address mode, up to 1Mbit/s |
PWM | 16, 32-bit timer/ counter |
Accessory of a development board including power adapter, debug cable
generally, the packing will be a development board a box (23*19*9cm)
Founded in 2007, Forlinx Embedded Tech. Co., Ltd. is a leading provider of trusted technology based embedded products and solutions. Forlinx offers comprehensive hardware design, system integration and product selling with global logistics support.
Aiming at providing customers with good-quality, high-performance products and service, Forlinx set up an R&D center in Beijing except in its headquarter city and got IDH authority of TI and Freescale in China mainland. With an excellent and experienced R&D team, stable supplying chain and powerful sales force, Forlinx has launched TI AM335x series, i.MX6 series based single board computers and system on modules, and also Samsung processors based development platforms to take users ready-to-use and easy-going development platforms, which help clients to shorten their product time-to-market.
In the future, we will spare no efforts to continue to take customers' demand as the guidance and in a spirit of innovation and enterprising to take customers more professional and efficient products and service.
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