Сохранить в закладки 1600848202938:
PCB Specification: | ||||||||||
PCB layers: | 1-24layers | |||||||||
PCB materials: | CEM1, CEM3, Teflon, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free | |||||||||
PCB max. board size: | 620*1100mm (Custom) | |||||||||
PCB certificate: | RoHS Directive-Compliant | |||||||||
PCB Thickness: | 1.6 ±0.1mm | |||||||||
Out Layer Copper Thickness: | 0.5-5oz | |||||||||
Inner Layer Copper Thickness: | 0.5-4oz | |||||||||
PCB max. board thickness: | 6.0mm | |||||||||
Minimum Hole Size: | 0.20mm | |||||||||
Minimum Line Width/Space: | 3/3mil | |||||||||
Min. S/M Pitch: | 0.1mm(4mil) | |||||||||
Plate Thickness and Aperture Ratio : | 30:1 | |||||||||
Minimum Hole Copper: | 20µm | |||||||||
Hole Dia. Tolerance(PTH): | ±0.075mm(3mil) | |||||||||
Hole dia. Tolerance(NPTH): | ±0.05mm (2mil) | |||||||||
Hole Position Deviation: | ±0.05mm (2mil) | |||||||||
Outline Tolerance: | ±0.05mm (2mil) | |||||||||
PCB solder mask: | Black, white, yellow | |||||||||
PCB surface finished: | HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver | |||||||||
Legend: | White | |||||||||
E-test: | 100% AOI, X-ray, Flying probe test. | |||||||||
Outline: | Rout and Score/V-cut | |||||||||
Inspection Standard: | IPC-A-610CCLASSII | |||||||||
Certificates: | UL (E503048),ISO9001/ISO14001/IATF16949 | |||||||||
Outgoing Reports: | Final Inspection, E-test, Solderability Test, Micro Section and More |
PCBA Technical Capability | |
1. Assembly Type:: | FR4, FPC, Rigid-flex PCB, Metal base PCB. |
2. Assembly Specification: | Min size L50*W50mm; Max size: L510*460mm |
3. Assembly thickness: | Min thickness: 0.2mm; Max thickness: 3.0mm |
4. Components Specification | |
Components DIP: | 01005Chip/0.35 Pitch BGA |
Minimum device accurace: | +/-0.04mm |
Minimum footprint distance: | 0.3mm |
5. File format: | BOM list; PCB Gerber file: |
6. Test | |
IQC: | Incoming inspection |
IPQC: | Production inspection; first ICR test |
Visual QC: | Regularly quality inspection |
SPI test : | Automatic solder paste optical inspection |
AOI: | SMD component welding detection, components shortage & component polarity detection |
X-Ravd: | BGA test; QFN and other precision devices hidden PAD device inspection |
Function test: | Test function and performance according to customer's test procedures and steps |
7. Reworking: | BGA rework equipment |
8. Delivery Time | |
Normal delivery time: | 24 hours( fastest 12 hours quick-turn) |
Small production: | 72 hours( fastest 24 hours quick-turn) |
Medium production: | 5 working davs. |
9. Capacity: | SMT assembly 5 million point/day;plug-in & welding 300,000 point/day; 50-100 items/day |
10. Components Service | |
A full set of substitute materials: | Have a experience component procurement sourcing, management system, and provide cost-effective services for OEM projects |
Only SMT: | Do SMT and backhand welding according to components PCB boards provided by customers. |
Components purchasing: | Customers provide core components, and we provide components sourcing services. |
Base Material | FR-4 |
Copper Thickness | 1OZ |
Board Thickness | 0.2mm |
Min. Hole Size | 0.25mm |
Min. Line Width | 4mil |
Min. Line Spacing | 4mil |
Aspect ratio | 8:1 |
Max layer | 16 layers |
Min. hole size | 10mil |
Min. line width/space | 0.1mm |
Max. Board size | 59in*22in |
Hole position tolerance | +/-0.076mm |
Routing outline tolerance | +/-0.13mm |
Punching outline tolerance | +/-0.05mm |
Production capability | 40,000 s.q.m/month |
Surface finished | Lead free HASL, immersion gold (ENIG), hard gold, gold fingers, immersion silver, immersion Tin, OSP etc. |
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