Для 4 сокетного SBI 8149P T8N супер B11QPi T четырехъядерный сокет P (LGA 3647) блейд сервер

Сохранить в закладки 1600909156976:


Цена:4 999,00 $*

Количество:

  • В избранное

Описание и отзывы

Характеристики



4-Socket Blade SBI-8149P-T8N
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Specification


SBI-8149P-T8N
Processor Blade SBI-8149P-T8N (Black)
Motherboard
Super B11QPi-T
Cores
Up to 28 Cores
Chipset
Intel® C622 chipset
Graphics
Aspeed AST2500 BMC
BIOS Type
128Mb SPI Flash EEPROM with AMI® BIOS
Hot-swap
8 Hot-Plug 2.5" NVMe (7mm) / 4 SATA3/NVMe drive bays (15mm)
M.2
2 PCI-E x4 connector for 2 M.2
KVM
1 Front Connector for SMCI KVM Card




Product Description









Key Features
200 CPUs per 42U Rack
Quad socket P (LGA 3647) supports 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)
Intel® C622 chipset
48 DIMMs; up to 12TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM
8 Hot-plug 2.5" NVMe (7mm) / 4 SATA3/NVMe drive bays (15mm)
Dual 10G onboard and/or 100G EDR InfiniBand/ Intel Omni-Path (Mezzanine card)
IPMI 2.0, KVM over IP, Virtual Media over LAN
Graphics: Aspeed AST2500 BMC


Dimensions and Weight


Height
13"
Width
1.75"
Depth
23.5"
Weight
24.2 lbs (11.0 kg)
Available Color
Black


Operating Environment


RoHS
RoHS Compliant

Environmental Spec.
* Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
* Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
* Operating Relative Humidity: 8% to 90% (non-condensing)
* Non-operating Relative Humidity: 5% to 95% (non-condensing)


Company Profile


Foshan Runli Technology Co., Ltd. is a domestic company with server accessories products, servers, storage, workstations, GPU computing servers, edge computing, high-performance computing and other solutions as its core business. Production advantages and mainland market advantages A service-oriented company that integrates all resources Demand, tailor-made system solutions for customers. Serving a variety of markets including cloud computing, data center, enterprise, big data, high performance computing, artificial intelligence, 5G, IoT, embedded and edge computing.


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